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TPCA Show 2026 spotlights energy-efficient AI, advanced packaging

AI summary

Taiwan's Printed Circuit Association (TPCA) says its 27th TPCA Show, running Oct 20–22 at Nangang Exhibition Hall 1, will focus on "Energy-Efficient AI: From Computing to Systems and Applications," with more than 680 international brands, 1,840+ booths and a projected 70,000 professional buyers. The co-located 21st IMPACT-IAAC conference opens Oct 19 at the Grand Hilai Taipei and is expected to feature nearly 350 technical presentations and more than 1,500 industry and academic attendees, expanding for the first time to two Nangang halls. Sessions centre on AI computing and system integration, next-generation packaging and substrates (glass substrates, panel-level packaging, hybrid bonding, chiplets), and thermal management, reliability and smart manufacturing.

In-depth insight

The agenda maps out where the AI compute hardware supply chain — substrates, advanced packaging and cooling — is heading, useful context for anyone following AI infrastructure.

TPCA Show 2026 規模創新高!攜手 IMPACT 深度串聯 PCB 與先進封裝,聚焦AI 新局

AI 需求引爆,PCB 產業迎接新機遇!隨著 AI 算力爆發引發硬體架構革新,台灣電路板協會(TPCA)年度盛會即將重磅登場。其中國際論壇「第21屆國際構裝暨電路板研討會(IMPACT-IAAC 2026)」將於 10 月 19 日於台北漢來飯店搶先揭開序幕,而電路板專業展「第 27 屆台灣電路板產業國際展覽會(TPCA Show 2026)」亦隨後於 10 月 20 日至 22 日於南港展覽館一館全面展開。展會今年聚焦在—「Energy-Efficient AI:From Computing to Systems and Applications」,將攜手打造 AI 硬體供應鏈最具指標性的年度盛事。

#TPCA#IMPACT-IAAC 2026#Unimicron#Phison#Zhen Ding Technology#Kinsus#ASE#Intel#KLA#Prismark#Stanford University

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