KLA

Headlines · 6

1. Oct 22
   Lam Research posts record fiscal Q1 revenue up 54%, but guidance only slightly beats

   Lam Research reported fiscal Q1 2027 revenue of $8.22 billion, up 54.4% year over year and above the $8.13 billion analyst estimate cited via Seeking Alpha, with adjusted earnings per share of $2.20 versus $2.19 expected. Systems equipment revenue rose about 62% to $5.73 billion and customer support revenue about 40% to $2.49 billion, while adjusted gross margin and operating margin reached 52.4% and 40.2%, both above market expectations. For fiscal Q2 the company guided revenue to $8.2–9.0 billion (midpoint $8.6 billion) and adjusted EPS to $2.18–2.48 (midpoint $2.33), only marginally above the $2.32 consensus, and the shares fell nearly 7% in after-hours trading, which IBD attributed to the lack of a bigger surprise.

   科技新报 · 🔥 0
2. Oct 20
   Musk sets aspirational 2028 target for Terafab chip production

   Elon Musk said on a SpaceX earnings call that Terafab, the chip-manufacturing joint venture of SpaceX and Tesla, plans to commission equipment in the first half of 2027 and produce its first working SRAM test chip around May or June at its Austin R&D site. The company targets volume production in the third or fourth quarter of 2028 at a planned Texas facility designed to fabricate logic and memory chips and conduct advanced packaging and testing. The project also has an annual goal of 1 terawatt of computing capacity for AI and robotics. Musk described the schedule as highly aspirational, with significant uncertainty, while saying ASML and other critical equipment suppliers are expediting shipments.

   IT之家 AI · 🔥 0
3. Oct 15
   SK hynix Reportedly Ties U.S. NAND Fab to Dalian Equipment

   Reuters-linked reports say SK hynix proposed building a NAND flash fab in the United States in exchange for approval to ship additional semiconductor equipment to Solidigm’s Dalian factory in China. Solidigm has applied for export licenses for tools intended for unused space in the Dalian Mod B building, while the U.S. fab remains a proposal and the shipments have not been authorized. SK hynix said the Mod B installation was being coordinated with U.S. authorities and conducted with authorization, and said it was not seeking to expand capacity there; a later report put the potential U.S. investment at $45 billion.

   TechSpot · 🔥 0
4. Oct 14
   NVIDIA launches cuPotential CUDA-X library for AI-defined fabs

   At SEMICON West, NVIDIA introduced cuPotential, a new CUDA-X library developers can use to build AI agents that simulate how atoms and molecules interact; NVIDIA says early-access testing accelerated already GPU-optimized workflows by an additional 2-3x, with Synopsys among early adopters. NVIDIA also said Applied Materials, Cadence, KLA, Lam Research, Siemens and Synopsys are using its accelerated computing and AI stack across chip design, manufacturing and testing, citing NanoVDB helping Lam Research reach 30x faster simulation, NPP accelerating KLA inspection, and cuLitho delivering up to 20x speedups on optical proximity correction workloads. cuPotential is available in early access, NanoVDB ships as open source within OpenVDB, and NPP is available through the CUDA Toolkit.

   NVIDIA Newsroom · 🔥 0
5. Oct 12
   KLA at SEMICON Taiwan: AI turns chip race into a 'learning velocity' contest

   Ahmad Khan, president of KLA's Semiconductor Products and Customer Group, said in a CEO Summit keynote at SEMICON Taiwan 2026 that Moore's Law still matters but AI is changing how semiconductors innovate: transistor scaling alone can no longer carry performance gains, so innovation is widening from a single chip to system-level integration of logic, HBM and 3D DRAM, advanced packaging and high-speed interconnects. He noted that leading-edge GPU dies are so large that a wafer may yield only about five chips, so a single yield-critical defect costs far more, and once stacked DRAM becomes HBM integrated with the GPU on an interposer, "the final yield is the sum of all the parts." Beyond fatal defects, long, high-load AI training and inference runs make latent defects a growing concern; KLA's broadband plasma optical inspection systems generate roughly 125 TB of data per hour, nearly 3 PB a day, which must be sifted with GPU-based high-performance computing plus AI models and physics algorithms. Khan argued the next phase of competition depends on how fast the ecosystem turns faster innovation, richer information and deeper collaboration into "learning velocity."

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6. Oct 8
   TPCA Show 2026 spotlights energy-efficient AI, advanced packaging

   Taiwan's Printed Circuit Association (TPCA) says its 27th TPCA Show, running Oct 20–22 at Nangang Exhibition Hall 1, will focus on "Energy-Efficient AI: From Computing to Systems and Applications," with more than 680 international brands, 1,840+ booths and a projected 70,000 professional buyers. The co-located 21st IMPACT-IAAC conference opens Oct 19 at the Grand Hilai Taipei and is expected to feature nearly 350 technical presentations and more than 1,500 industry and academic attendees, expanding for the first time to two Nangang halls. Sessions centre on AI computing and system integration, next-generation packaging and substrates (glass substrates, panel-level packaging, hybrid bonding, chiplets), and thermal management, reliability and smart manufacturing.

   科技新报 · 🔥 0

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