SK hynix offers U.S. NAND fab for Dalian chip equipment export license
Reuters reported that Solidigm, SK hynix's U.S. subsidiary, has applied for a U.S. export license to install additional NAND flash manufacturing equipment in unused space at its Dalian Mod B facility in China, which was completed in 2023 and uses tools from Applied Materials, KLA and Lam Research. In exchange for approval, SK hynix has proposed building a new 3D NAND fab in the United States, while the U.S. Commerce Department granted only a limited 2026 equipment-delivery authorization for Dalian last December and has not issued a similar authorization for 2027. SK hynix told Reuters that equipment installation at Mod B is proceeding in close consultation with and under authorization from the U.S. government, and said it is not currently seeking to expand the site's capacity; Solidigm declined to comment. One source also said Solidigm is considering an IPO as early as 2027 to fund a U.S. plant, with northern New York among the candidate sites.
With AI data-center demand tightening memory supply, the reported swap shows how U.S. fab commitments are being used as leverage in export-control negotiations over China-based capacity.