Applied Materials
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- Applied Materials and Intel Expand Collaboration on AI Chip Manufacturing
Applied Materials and Intel announced a collaboration at Applied Materials’ EPIC Center and Intel’s Hillsboro research campus to advance transistor, interconnect, and advanced packaging technologies for AI computing. The work includes materials and process development for advanced logic nodes, interconnect scaling, and packaging for Intel’s Foveros 3D stacking; the companies say it is intended to accelerate the path from research to U.S. production.
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