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- Kioxia market value down about two-thirds from June peak as AI storage rally cools
Kioxia's market capitalization has fallen from roughly 60 trillion yen in June to about 21 trillion yen in mid-October, a drop of around two-thirds. On Oct. 15 the stock fell as much as about 14% intraday and closed down roughly 12.3%, then ended the next session at 13,375 yen — about 64% below the June 22 high of around 37,565 yen on a split-adjusted basis after the company's 3-for-1 split on Oct. 1. The company reported fiscal 2026 first-quarter revenue of 1.767 trillion yen, operating profit of 1.27 trillion yen and net profit of about 842.2 billion yen for the period through June, and guided to 2.39 trillion yen in revenue and about 1.89 trillion yen in operating profit for the July–September quarter, with results due Oct. 30. The report attributes the pullback to higher interest rates prompting scrutiny of AI data-center financing and returns, plus competitive pressure from China's YMTC, which Counterpoint Research estimates rose to third place in NAND bit shipments in Q2 2026 with about 16.5% share.
cnBeta · 🔥 10 - Morgan Stanley lifts Q4 DRAM, NAND contract price forecasts; compute still top AI pick
A Morgan Stanley report raised its memory contract-price forecasts: Q4 2026 DRAM contract prices are now seen up 10–15% quarter over quarter (from +3–8%), with PC DRAM at +13–18% and server DRAM at +10–15%, while NAND moves to +15–20% from +0–5% and enterprise SSDs reach +23–28%. The bank forecasts 2027 HBM average selling prices up 121% year over year, with HBM4 at US$3–5 per Gb and HBM4e above US$5, but says Nvidia's Rubin ramp is behind schedule, with 2026 VR200 NVL72 rack shipments estimated below 10,000 units versus an original target of about 15,000. It keeps its AI supply-chain priority of compute first, networking second and selective memory allocation, and projects DRAM capex of US$98 billion in 2026 (+82%) rising to US$150–160 billion in 2027.
科技新报 · 🔥 9 - Ex-Intel CEO Gelsinger: Most AI chip design firms will disappear
Speaking on an a16z podcast, former Intel CEO Pat Gelsinger said the boom in AI inference chip companies — hundreds of them today — is probably temporary, with most chip architectures likely to be淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰淘汰
36氪 人工智能 · 🔥 6 - NVIDIA Rubin said to stick with 12-layer HBM4 as HBM prices seen up 121% in 2027
A supply-chain survey cited by Counterpoint Research indicates most of NVIDIA's next-generation Rubin AI accelerators will keep the originally planned 12-layer HBM4 stacks, rather than shifting broadly to 8-layer HBM4 as earlier rumors suggested. NVIDIA's published roadmap lists 12-high HBM4 with up to 288GB of memory per GPU and bandwidth up to 22TB/s; Korean media had reported that NVIDIA asked Samsung Electronics and SK hynix for more 8-layer HBM4 supply, and industry observers say the two accounts need not conflict — some products may use 8-layer stacks to ease capacity pressure while flagship Rubin parts stay at 12 layers. Separately, TrendForce forecasts HBM average selling prices could rise 121% year over year by 2027, driven mainly by the mix shift from HBM3E to pricier HBM4 rather than pure shortage; because the costly base die is spread over fewer memory layers, 8-layer HBM could cost 10% to 20% more per Gb than 12-layer in 2027.
cnBeta · 🔥 3 - SK hynix unveils 3D FeNAND for analog compute-in-memory AI
SK hynix has published research showing how ferroelectric 3D NAND (3D FeNAND) can perform analog compute-in-memory (A-CiM), with the work appearing in an IEEE paper. The approach stores data and controls current via the polarization state of ferroelectric material, allowing a single cell to produce multiple current states suited to AI weight data, and lets NAND carry out multiply-accumulate (MAC) operations inside the memory to cut data movement. Simulated results under die-size constraints show up to 20x higher throughput and up to 5,000x better energy efficiency than conventional 2D non-volatile memory arrays; the company also presented the technology at OCP Global Summit 2026, saying NAND could eventually support data center and AI workloads beyond storage.
IT之家 AI · 🔥 12 - Musk blasts memory makers' 'extortionate' pricing, praises Micron
Amid an ongoing shortage of conventional DRAM and high-bandwidth memory, Elon Musk posted on X that Micron has been "reasonable regarding future memory prices, while others have been extortionate, which is something today's customers will not forget," calling Micron's stance smart for long-term customer loyalty. Musk did not name the companies he was criticizing or disclose any pricing terms, so it is impossible to verify whether Samsung and SK hynix charge substantially more than Micron for comparable products, though the report reads his remarks as aimed at the two South Korean makers. The report notes Micron's latest quarter (fiscal Q4 2026) showed $54.23 billion in revenue and an 81% GAAP gross margin, up from 40% a year earlier, plus 26 long-term supply agreements covering more than 35% of expected revenue through 2030 with $32 billion in customer financial commitments; Samsung reportedly locked up long-term contracts for 75%–80% of its planned 2027 memory output.
Tom’s Hardware · 🔥 3 - SK hynix offers U.S. NAND fab for Dalian chip equipment export license
Reuters reported that Solidigm, SK hynix's U.S. subsidiary, has applied for a U.S. export license to install additional NAND flash manufacturing equipment in unused space at its Dalian Mod B facility in China, which was completed in 2023 and uses tools from Applied Materials, KLA and Lam Research. In exchange for approval, SK hynix has proposed building a new 3D NAND fab in the United States, while the U.S. Commerce Department granted only a limited 2026 equipment-delivery authorization for Dalian last December and has not issued a similar authorization for 2027. SK hynix told Reuters that equipment installation at Mod B is proceeding in close consultation with and under authorization from the U.S. government, and said it is not currently seeking to expand the site's capacity; Solidigm declined to comment. One source also said Solidigm is considering an IPO as early as 2027 to fund a U.S. plant, with northern New York among the candidate sites.
Wccftech · 🔥 9 - Dan Bin reverses: memory price surge is squeezing AI capex
Investor Dan Bin has flipped his long bullish stance on the memory sector, arguing the AI boom requires steadily falling token costs while rising memory prices push compute costs in the opposite direction. Citing estimates from Goldman Sachs, CICC and RBC, the column says memory inflation is eating into hyperscaler profits — CICC calculates that under a 170% memory price increase, token-generation efficiency per dollar on GB300 deployments is 37% lower than on GB200, and about $25bn of Microsoft's $190bn capex comes from memory price increases that add no new compute. It also says the four big cloud providers' combined free cash flow fell from roughly $60bn in Q4 2025 to about $7bn in Q2 2026, operating cash flow coverage of capex dropped from 1.79x to 1.06x, and tech giants have issued nearly $220bn of bonds in 2026 amid rising financing costs. The conclusion: whether the AI investment cycle can continue depends on costs falling and AI revenue catching up with both spending and financing costs. (Opinion and third-party estimates, not official figures.)
36氪 人工智能 · 🔥 0 - Asian chip stocks tumble as AI funding worries and Fed rate hike fears mount
CNBC reported that Asian chipmakers extended Wall Street's losses as worries over AI funding and a possible US Fed rate hike mounted: SK Hynix fell more than 10% on the KRX and Samsung dropped about 10%, while Nvidia, Micron and AMD were all lower in premarket trading. Separately, CCTV via 36Kr said Japan's Nikkei index closed down 4.90% at 64,425.95 on October 15, a fall of 3,318.34 points and its biggest single-day drop since March, dragged by semiconductor equipment names such as Advantest and Tokyo Electron. The reports attributed the selloff to a higher-than-expected US September consumer price index, which raised rate-hike expectations and reduced risk appetite, hitting AI and semiconductor shares.
Techmeme · 🔥 4 - Transsion falls below IPO price in Hong Kong debut as AI-driven memory costs bite
Transsion Holdings listed in Hong Kong on Oct 15, opening at HK$34.96 — below its HK$35.30 offer price — and dropped more than 7% intraday, after pricing at the bottom of its range and drawing only 4.46x subscription in the Hong Kong public tranche. The prospectus pins the cost pressure largely on memory-chip prices: average memory purchase prices reached nearly 200 yuan per unit in the first four months of 2026 versus about 70 yuan for all of 2025, according to a memory-module industry source cited in the report, with memory accounting for 48.4% of the cost of goods sold. Transsion plans to spend roughly 40% of net proceeds (about HK$1.2 billion) on AI R&D, raise DRAM purchases from ChangXin Memory to 60% and NAND from Yangtze Memory to 30%, and use localized AI features such as its Ella voice assistant and Hi Translate app to push into higher price tiers.
虎嗅 AI · 🔥 0 - IMF warns AI sector wipeout could become global financial contagion
In its latest Global Financial Stability Report, the IMF warns that the global economy is growing increasingly dependent on capital flows into AI, and that a sharp correction could turn into a global financial shock through leverage and circular investment. The report distinguishes "core" AI firms — such as chipmakers, memory and storage vendors — from other players, and notes hedge funds have raised leveraged positions and margin borrowing, while single stocks now make up 28% of leveraged ETFs. Tracking 14 public transactions since 2023, the IMF found $300 billion invested in "financially weaker" AI companies plus $650 billion in debt corresponded to $1.4 trillion in services and chip-order revenue. Under its scenario, global GDP could fall 0.4%, investment 1.3% and consumption 0.6% by 2028, though bank stress tests suggest lenders would remain "broadly resilient" and hyperscalers now account for 10% of investment-grade bond issuance, up from under 1% in 2024.
Tom’s Hardware · 🔥 0 - SK hynix forecasts ~20x AI infrastructure performance growth by 2030
Speaking at the 28th Korea Semiconductor Exhibition (SEDEX 2026) in Seoul, SK hynix head of development Ahn Hyun predicted that AI infrastructure performance scale will grow about 20-fold by 2030, according to Yonhap. He said the AI inference market is expanding along three axes at once — rising task complexity, surging context length and a flood of inference requests — inflating KV Cache capacity and forcing data to be spread across HBM, DRAM and SSD, with the resulting data movement becoming a new bottleneck for performance and power. Beyond tuning existing HBM, SK hynix is developing 3D-stacked DRAM that places DRAM directly atop logic chips such as GPUs and NPUs, and High Bandwidth Flash (HBF) that brings through-silicon-via stacking and high-speed I/O to NAND, targeting roughly 50% of same-generation HBM bandwidth with about 10x the capacity.
IT之家 AI · 🔥 0 - CXMT's 4F² DRAM breakthrough triggers global memory chip selloff
On Oct. 10 CXMT president Cao Kanyu said at the 4th Integrated Chip and Chiplet Conference that the company had made key progress on a 4F² DRAM architecture built around its self-developed VSG vertical-surrounding-gate transistor, and expects to ship next-generation DDR5 RDIMM products combining 4F² with wafer-level hybrid bonding by year-end. Memory stocks then fell hard: Samsung closed down 7.39%, SK Hynix dropped 10.09%, the KOSPI lost 5.46% and triggered a SIDECAR program-trading halt, and Micron slipped below $1,000 a share, while CNBC tied the wider Asia tech rout partly to Fed rate-hike fears and worries about AI investment returns. The report also says CXMT posted first-half revenue of 150.3 billion yuan, up 873.64% year on year, with net profit of 77.6 billion yuan and a global DRAM revenue share that rose from 4% in Q2 2025 to 10% in Q2 2026, though its HBM3E is not expected to reach mass production until 2027, roughly three to four years behind Samsung and SK Hynix.
36氪 人工智能 · 🔥 0 - Paul Tudor Jones says 2027 will be 'really challenging' for stocks as AI IPO wave looms
Hedge fund manager Paul Tudor Jones said 2027 will be a "really challenging" year for U.S. stocks, with the most unfavorable supply-demand backdrop for capital since 2002, and he plans to short the market through the year. He argued that a surge in tech share issuance in 2026 — including possible listings by Anthropic and OpenAI, a SpaceX IPO and SK Hynix's U.S. share sale — could sharply increase equity supply and reverse the buyback-and-M&A-driven bull market. He also flagged U.S. fiscal deficits and estimated oil could rise another $20–25 a barrel after the midterm elections. The report cites a Goldman Sachs note saying U.S. companies have raised $431 billion so far this year via IPOs, follow-on offerings, convertibles and SPACs, with a full-year total possibly reaching $675 billion.
科技新报 · 🔥 0 - SK chair Chey Tae-won sells 544bn won of SK Inc shares to Michael Dell family fund
Regulatory filings show SK Group chairman Chey Tae-won has agreed to sell 972,493 SK Inc shares, a 1.34% stake, to DFO Public Investments, L.P. — a fund tied to Dell Technologies founder Michael Dell — for 544 billion won (about 2.731 billion yuan). The sale is part of a plan to raise 9,440 billion won (about 4.74 billion yuan) by selling 1.65 million shares, or 2.26%, to pay a divorce settlement to his former wife, with 681,431 shares (0.94%) going to Korea Investment & Securities for 400 billion won. The buyer is a Delaware-registered fund under DFO Management, Michael Dell's family investment office, not Dell Technologies itself; Dell Technologies is a core supplier of AI servers and data center infrastructure and does business with SK Group's memory chip unit SK hynix.
IT之家 AI · 🔥 0 - AI's boom runs on debt: the financing chain behind the compute buildout
An analysis republished by 36Kr (originally from Yuanchuan Research Institute) argues AI infrastructure is being financed heavily with borrowed money: Tencent is reportedly weighing up to $5bn in offshore bonds, ByteDance has a $29.6bn syndicated loan from 30 banks, and Alphabet and Amazon issued tens of billions in bonds this year. It says Anthropic must spend $125.2bn leasing compute over five years, with Broadcom lending up to $42bn to fund it, and cites Morgan Stanley's estimate that roughly $450bn of AI-related debt was issued by September, more than double all of last year. The piece also cites FT-reported OpenAI internal roadshow materials projecting $840bn cumulative 2026-2030 revenue against $856bn of spending and negative $278bn cumulative free cash flow, while SoftBank raised $11.1bn in high-yield bonds (up to 9.75% coupon) and has invested $64.6bn for a 13% OpenAI stake.
36氪 人工智能 · 🔥 0 - Goldman Sachs: high-bandwidth flash could break AI memory wall, up to $150B market
In a research note dated Oct. 12, Goldman Sachs said fast-growing AI inference demand is making insufficient memory capacity a bottleneck on compute efficiency, and that new NAND technologies such as high-bandwidth flash (HBF) could ease this "memory wall" and notably cut AI infrastructure costs. The bank estimates a potential HBF market of $40 billion to $150 billion, assuming GPU adoption rates of 15% to 50%. Goldman flagged SanDisk and SK Hynix as HBF technology leaders, keeping "buy" ratings on both, said Samsung Electronics should also benefit, and kept a "neutral" rating on Micron, whose business is weighted toward DRAM and HBM with less direct exposure.
36氪快讯 · 🔥 0 - SK hynix unveils H-TPU, a tiny SSD controller core it says draws 2.5% of a CPU core's power
SK hynix detailed an in-house processor architecture called the Hynix Transaction Processing Unit (H-TPU), presented by SoC design vice president Koo In-jae at the ISOCC 2026 conference in Songdo, Incheon on October 12. The company says H-TPU is not an AI tensor accelerator but a programmable processor for SSD data-plane and transaction control, using a simplified four-stage, in-order pipeline without superscalar or out-of-order units; it claims the core takes about 4% of a general-purpose CPU core's area and roughly 2.5% of its power. Instead of one monolithic CPU, SK hynix splits more than 100 repetitive functions — such as read/write command processing, metadata and buffer control — across dozens of small TPU clusters, activating only the modules a task needs while the traditional Arm CPU keeps management duties, per the reports. SK hynix plans to apply H-TPU across its NAND product lines, including next-generation enterprise SSD controllers, then in its next-generation AI storage architecture 'Storage Next', and expects synergies with its high bandwidth flash (HBF) due next year.
IT之家 AI · 🔥 0 - Applied Materials sees revenue doubling in a few years with AI, not headcount
Applied Materials CEO Gary Dickerson said the semiconductor equipment maker expects to double revenue over the next few years without a commensurate rise in headcount, because it is relying more on AI tools for work such as product development and quality control. The comments followed the company's unveiling of a $5 billion EPIC center in Sunnyvale, California — a 600,000-square-foot R&D facility built with customers including TSMC, Intel, Samsung, Micron and SK hynix to speed equipment and process innovation. Dickerson said AI has driven productivity gains of up to about 50% in some parts of the business, where the company will keep hiring, but he declined to forecast headcount; Applied Materials had roughly 38,900 employees as of late July. He added that funding, materials, energy and capacity shortages could slow AI's expansion in the short term, while calling the longer-term growth "transformational."
Bloomberg Technology · 🔥 0 - Wang Yuquan: AI is no bubble, but 2029 is the risk window
Technology investor Wang Yuquan of Haiyin Capital argues in a conversation that the current AI boom is not a bubble but a decade-plus technology shift, with the real risk window around 2029, when application paradigms in AI software, AI coding and autonomous driving become clear while revenue lags behind infrastructure spending. He expects 24/7 trading, quantitative strategies and stablecoin growth to amplify market swings, hurting memory makers such as SK Hynix and South Korea hardest, while leaders like Nvidia are undervalued. He also calls embodied AI and large language models overhyped, urges Chinese labs to close their models for safety and revenue reasons, and predicts a 70-30 split favoring China outside the US.
虎嗅 AI · 🔥 0 - Forecast: Humanoid Robots to Drive 20x Memory Demand by 2030
A recent forecast cited by cnBeta projects that memory demand from humanoid robots will surge 20-fold by 2030. The report says humanoid robots could become the next growth driver for Samsung Electronics and SK Hynix, after AI servers and consumer electronics, with the memory industry actively positioning itself. The report does not name the forecasting organization or explain the baseline and methodology behind the figure.
cnBeta · 🔥 0 - HBM yield ceiling: TrendForce forecasts 2027 supply tightness, blended ASP up 121%
TrendForce's latest research estimates memory supply will remain tight through 2027 and has revised up its HBM price outlook, projecting blended ASP to rise about 121% year over year, driven by tight overall supply, a higher share of pricier HBM4 shipments and the gradual ramp of HBM4e in the second half of 2027. The article argues that beyond advanced wafer capacity, stacking yield is the key constraint on effective supply: TrendForce data puts current HBM yield at only 50%-60%, with yields typically falling for each new generation, while JPMorgan data shows 58% of 2025-2028 DRAM capacity additions going to HBM, lifting HBM's share of total DRAM capacity from 19% to 31%. Micron has said it will work with TSMC on mass production of next-generation HBM4E in 2027, and per TrendForce, NVIDIA has been reassessing Rubin Ultra's HBM configuration since Q3 2026, weighing HBM4e 12hi/8hi against HBM4 12hi/8hi.
虎嗅 AI · 🔥 0 - Korea chip show opens Oct 14 with HBM4E, physical AI chips in focus
South Korea's semiconductor industry association said the 28th Korea Semiconductor Exhibition (SEDEX 2026) will run Oct 14-16 at COEX in Gangnam, Seoul, under the theme "Into the Era of Silicon Intelligence," with 300 companies and 888 booths, a record size. Samsung Electronics will show next-generation memory structures and products for cloud, edge computing and physical AI, including high bandwidth memory (HBM), mobile image sensors, mobile processors, high-reliability automotive chips, foundry solutions and 3D memory structures. SK Hynix will unveil next-generation memory technologies including seventh-generation HBM (HBM4E) and high bandwidth flash (HBF), alongside flagship server, PC and mobile DRAM, NAND flash and SSD products; Korean materials, parts and equipment makers such as Jusung Engineering, SEMES and Hanmi Semiconductor will also exhibit.
36氪快讯 · 🔥 0 - Samsung said to lock in ~80% of 2027 memory capacity via long-term deals
Industry sources cited by Korean media reports say Samsung Electronics has locked in close to 80% of next year's (2027) memory chip capacity through long-term supply agreements, covering high-bandwidth memory (HBM), conventional DRAM and other memory products used in AI infrastructure. NVIDIA, Google and Microsoft are among the customers reportedly placing orders, with supply terms generally spanning five years or more. Samsung said on its Q2 earnings call that almost all key customers are pressing hard for long-term deals and that it cannot fully meet demand; SK hynix and Micron have also signed large long-term agreements with major customers.
IT之家 AI · 🔥 0 - Samsung develops zNAND-T and zNAND-I flash for AI workloads
Korean outlet ZDNET Korea reports that Samsung Electronics is developing two NAND flash products tuned for AI workloads, zNAND-T and zNAND-I. zNAND-T stands for throughput, using TSV-stacked NAND dies to optimize read/write bandwidth for data-center AI silicon, an approach the report likens to the HBF concept proposed by SanDisk and SK hynix; zNAND-I refers to IOPS and targets random performance in scenarios with frequent small reads and writes, such as KV cache offloading. Separately, Samsung announced a next-generation memory and storage technology strategy for AI infrastructure spanning high-performance memory, Compute Express Link (CXL)-based storage expansion, and new-generation SSD data storage and management. Together with the previously disclosed zNAND-O, the three zNAND variants are positioned for different workloads, which the report frames as a shift from general-purpose NAND toward customization.
IT之家 AI · 🔥 0 - AI memory squeeze: PC shipments fall 20%, but Lenovo and Dell earn more
IDC data cited by the report shows global PC shipments of 62.7 million units in Q3 2026, down 20.1% year on year, with all top five vendors — Lenovo, HP, Dell, Apple and ASUS — declining (Apple -11.3%, HP -30.9%). The article attributes the pressure to AI datacenters taking memory capacity: a 16GB DDR5 module reportedly rose from about 300 yuan in September to about 1,400 yuan in January, and DRAM plus SSDs grew from roughly 15% to nearly 40% of PC cost, forcing vendors to raise prices and reprice far more often. Profits diverged: Apple's Mac revenue rose 29% to $10.35 billion, ASUS brand operating profit rose 230%, Lenovo's ISG revenue grew 98% and swung to profit, and Dell's AI server revenue of $16.4 billion exceeded its PC business, while HP's Personal Systems operating margin fell to 4.6%.
钛媒体 · 🔥 0 - Samsung offers memory as leverage for AMD foundry orders; AMD stays cautious
AMD CEO Lisa Su visited South Korea to secure stable high-bandwidth memory (HBM) supply for its AI accelerators and said she would discuss a broader partnership with Samsung executives. Samsung hopes to use its memory supply as leverage to win foundry production of AMD's advanced logic chips; according to Korean outlet THE ELEC, the two firms signed a three-year, non-binding MOU in March 2026 covering HBM4 and advanced DDR5 supply, joint memory optimization for AI and HPC, evaluation of AMD platforms made at Samsung foundry, and advanced packaging cooperation. Su also confirmed AMD has begun shipping next-generation Instinct MI455 chips with 432GB of HBM4 and Helios AI rack systems, with Samsung currently the main HBM4 supplier for the MI400 series, though AMD warned in its latest annual report that shifting production to a new foundry could bring delays, lower yields or weaker performance.
科技新报 · 🔥 0 - AI memory squeeze drives up device prices as the cheap electronics era ends
An opinion piece argues that AI data centers' appetite for HBM is squeezing consumer-grade memory capacity and passing the cost down to ordinary buyers. Citing TrendForce, it says smartphone LPDDR5X contract prices rose 78%–83% quarter-on-quarter in Q2 2026, with a single 12GB LPDDR5X chip going from $77 in Q1 to $146; Samsung, SK Hynix and Micron control over 95% of the DRAM market, HBM margins exceed 70%, and HBM's share of DRAM wafer capacity has climbed from 8% two years ago to 23%, heading for 30% next year. The article also notes Apple's Mac mini entry price moving from $599 to $799, Microsoft's Xbox Series S rising from $299 to $499, and Nothing scrapping the CMF Phone 2 Pro successor because memory was too expensive, and cites IDC forecasts of 10%–20% higher PC, tablet and phone prices in 2026 with smartphone shipments falling 13%. The author calls these increases a hidden "AI tax" consumers pay without noticing.
虎嗅 AI · 🔥 0 - AI investment cooldown: foreign investors pull $131B from Korean stocks
As the AI investment boom cools, foreign investors have net sold about $131 billion of Korean equities this year, the largest outflow among major Asian markets, while the KOSPI has fallen 22% since the second half of 2026 and trading volume has shrunk about 70% from its late-May peak. Samsung Electronics and SK Hynix together account for more than 50% of the index's weight; Samsung's quarterly operating profit rose nearly ninefold year on year yet its shares still fell, and the two companies' combined 55 trillion won (about $41 billion) buyback programs are nearing completion. Retail participation is also fading, with margin loan balances down from a June peak of 38.6 trillion won to about 33 trillion won and broker customer deposits falling from near 140 trillion won to about 100 trillion won.
cnBeta · 🔥 0 - AI datacenter demand revives DDR4 and old PC platforms as memory prices climb
Ifanr reports that as AI datacenters absorb memory capacity, consumer PCs are moving backwards: Gigabyte announced on October 9 that existing B760 and H610 motherboards can support Intel's upcoming LGA1700 processors, expected in early 2027, via BIOS updates, with DDR4 still on the compatibility list, while Intel has repeatedly said DDR4-supporting Raptor Lake remains a core strategy with stable supply for years. AMD launched a 10th-anniversary Ryzen 7 5800X3D at Computex 2026 at a $349 suggested price (2,599 yuan in China), with board makers adding new B550X series boards, and the 2021-era RTX 3060 12GB returned to retail this summer at about $339.99, rising to $460–500 at most retailers by late August. IDC data cited by the outlet put Q3 2026 global PC shipments below 63 million units, down 20.1% year over year and 9.1% quarter over quarter; Omdia says DRAM and SSDs now approach 40% of mainstream PC bill-of-materials costs, and TrendForce expects Q4 conventional DRAM contract prices up another 10%–15% and NAND Flash up 15%–20%.
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