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Prismark

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Headlines · 3

  1. AI Demand Lifts PCB Earnings and High-End Capacity Expansion

    A review of 2026 third-quarter earnings by 财联社 shows that AI servers, high-speed switches, optical modules and IC substrates are driving stronger demand for high-layer-count, high-frequency and high-order HDI PCBs. Several PCB companies reported strong profit growth and fuller production lines, while manufacturers are expanding capacity to serve AI-related orders. The report also notes tight upstream material supply, equipment lead times and cost pressures that may constrain the pace of capacity releases.

    虎嗅 AI · 🔥 0
  2. TPCA panel: AI demand pushes PCBs past 70 layers as equipment lead times stretch to 2–3 years

    At the 2026 TPCA Show industry forum on Oct. 21, Prismark partner Chiang Hsu-kao (姜旭高) said PCB growth momentum has shifted markedly toward AI, with demand rising for high-end PCBs, HDI and IC substrates, while consumer-electronics players face higher material prices, longer equipment lead times and lower purchasing priority. He warned that some equipment deliveries may take two to three years, and that if new capacity outpaces demand growth the industry could face oversupply and price pressure. Unimicron executive general manager Lan Ting said AI servers, switches and storage are pushing high-end PCBs from 30–40-plus layers toward more than 70 layers and IC substrates past 30 layers, requiring integrated equipment data, inspection data and production systems to improve yield.

    科技新报 · 🔥 0
  3. TPCA Show 2026 spotlights energy-efficient AI, advanced packaging

    Taiwan's Printed Circuit Association (TPCA) says its 27th TPCA Show, running Oct 20–22 at Nangang Exhibition Hall 1, will focus on "Energy-Efficient AI: From Computing to Systems and Applications," with more than 680 international brands, 1,840+ booths and a projected 70,000 professional buyers. The co-located 21st IMPACT-IAAC conference opens Oct 19 at the Grand Hilai Taipei and is expected to feature nearly 350 technical presentations and more than 1,500 industry and academic attendees, expanding for the first time to two Nangang halls. Sessions centre on AI computing and system integration, next-generation packaging and substrates (glass substrates, panel-level packaging, hybrid bonding, chiplets), and thermal management, reliability and smart manufacturing.

    科技新报 · 🔥 0

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