Unimicron

Headlines · 2

1. 23h
   TPCA Show 2026 spotlights energy-efficient AI, advanced packaging

   Taiwan's Printed Circuit Association (TPCA) says its 27th TPCA Show, running Oct 20–22 at Nangang Exhibition Hall 1, will focus on "Energy-Efficient AI: From Computing to Systems and Applications," with more than 680 international brands, 1,840+ booths and a projected 70,000 professional buyers. The co-located 21st IMPACT-IAAC conference opens Oct 19 at the Grand Hilai Taipei and is expected to feature nearly 350 technical presentations and more than 1,500 industry and academic attendees, expanding for the first time to two Nangang halls. Sessions centre on AI computing and system integration, next-generation packaging and substrates (glass substrates, panel-level packaging, hybrid bonding, chiplets), and thermal management, reliability and smart manufacturing.

   科技新报 · 🔥 5
2. 1d
   Chip selloff deepens as funds rotate from AI-server names to CPO, ABF and MLCC

   Taiwan's benchmark index closed up 0.22% at 49,822.55 on Oct 7, while the Philadelphia Semiconductor Index fell 1.15% to 13,066.15 and TSMC's ADR slipped 0.72% as the US 10-year Treasury yield rose to 5.28%, near a 24-year high; Taiwan futures dropped below the 50,000 mark in overnight trading. The three main institutional investor groups sold a combined NT$24.16bn, concentrated in AI-server, ASIC IP and semiconductor test-interface names, with money rotating into co-packaged optics (CPO), ABF substrates and high-end CCL, MLCC passive components, and petrochemicals. The report says AI servers use 3–5x more MLCCs than conventional servers and that the ABF substrate shortfall runs through 2027.

   科技新报 · 🔥 5

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