Kinsus

Headlines · 2

1. Oct 19
   AI demand pushes Taiwan PCB output toward NT$1.1 trillion as TPCA Show opens

   Taiwan's Printed Circuit Board Association (TPCA) estimates the island's PCB output at home and abroad will reach NT$1,136.5 billion in 2026, up 24.2% year on year and a record high, driven by AI infrastructure demand for high-end substrates, high-layer-count boards and HDI, plus tight high-end materials that are lifting prices. First-half PCB materials output reached NT$271.6 billion, up 38.6%, as glass fiber cloth and copper foil stayed in short supply. TPCA said the squeeze has spread from materials such as Low CTE, Low Dk2 and HVLP4 to CCL, ABF substrates and process equipment and consumables, with some new capacity only arriving between 2027 and 2029 and tightness expected to last at least into 2027. The 2026 TPCA Show runs October 20-22 at Taipei Nangang Exhibition Center, with Unimicron, Kinsus, Compeq, Wus Printed Circuit, Elite Material, Taiwan Union Technology and others exhibiting.

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2. Oct 8
   TPCA Show 2026 spotlights energy-efficient AI, advanced packaging

   Taiwan's Printed Circuit Association (TPCA) says its 27th TPCA Show, running Oct 20–22 at Nangang Exhibition Hall 1, will focus on "Energy-Efficient AI: From Computing to Systems and Applications," with more than 680 international brands, 1,840+ booths and a projected 70,000 professional buyers. The co-located 21st IMPACT-IAAC conference opens Oct 19 at the Grand Hilai Taipei and is expected to feature nearly 350 technical presentations and more than 1,500 industry and academic attendees, expanding for the first time to two Nangang halls. Sessions centre on AI computing and system integration, next-generation packaging and substrates (glass substrates, panel-level packaging, hybrid bonding, chiplets), and thermal management, reliability and smart manufacturing.

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