Phison

Headlines · 5

1. Oct 21
   TPCA panel: AI demand pushes PCBs past 70 layers as equipment lead times stretch to 2–3 years

   At the 2026 TPCA Show industry forum on Oct. 21, Prismark partner Chiang Hsu-kao (姜旭高) said PCB growth momentum has shifted markedly toward AI, with demand rising for high-end PCBs, HDI and IC substrates, while consumer-electronics players face higher material prices, longer equipment lead times and lower purchasing priority. He warned that some equipment deliveries may take two to three years, and that if new capacity outpaces demand growth the industry could face oversupply and price pressure. Unimicron executive general manager Lan Ting said AI servers, switches and storage are pushing high-end PCBs from 30–40-plus layers toward more than 70 layers and IC substrates past 30 layers, requiring integrated equipment data, inspection data and production systems to improve yield.

   科技新报 · 🔥 0
2. Oct 18
   Corbenic's Galahad puts KV cache on server SSDs; its 14x claim draws scrutiny

   TechRadar reports that Belgian startup Corbenic AI's Galahad, in beta since October 1 2026, writes a model's KV cache to encrypted local NVMe storage and reloads it after GPU memory is cleared or the server restarts, so the model need not reread the same text. Founder Sietse Schelpe says it needs only Linux, an Nvidia GPU and a standard NVMe drive, with no special hardware. The report notes, however, that the headline 14x figure owes most to a retrieval component called Blaise, which hands the model roughly 668 tokens instead of the whole corpus; with the KV component Taliesin alone, vLLM took 15.56 seconds per question versus an 8.11-second baseline, and SGLang 22.02 versus 10.29. It also notes that LMCache, Nvidia Dynamo, WEKA and Phison already persist KV cache to storage, and that Corbenic's numbers come from the founder's own runs on rented cloud GPUs in self-published preprints, with raw logs not yet released.

   TechRadar · 🔥 0
3. Oct 12
   Taiwan health ministry pushes FHIR Box platform to break hospital AI silos

   Lee Chien-chang, head of the information office at Taiwan's Ministry of Health and Welfare, said hospitals have long built their own health information systems (HIS), making it hard to reuse AI or apps developed by another hospital. The ministry's FHIR Box aims to create a common environment on top of existing HIS, bundling FHIR data-conversion tools, a high-performance FHIR server, a CQL rules engine, clinical decision support and a SMART on FHIR app runtime. The plan centers on FHIR data standards, a shared CQL rules library and the SMART on FHIR framework, with targets to deploy across all medical centers by the end of 2026 and expand to regional and district hospitals by the end of 2027. The report says Linkou Chang Gung, Mackay Memorial and Chung Shan Medical University Hospital have demonstrated cross-hospital record exchange and anticoagulant bleeding-risk analysis; the ministry set up a national interoperability and performance certification lab in August and selected 50 SMART on FHIR apps from 115 entries in April, while planning data, rules and app ecosystems.

   iThome 台湾 · 🔥 0
4. Oct 8
   Phison September revenue up 370% YoY as AI modules pass half of sales

   Phison reported September 2026 consolidated revenue of NT$30.639 billion, up 8% month-on-month and 370% year-on-year, with third-quarter revenue of NT$86.077 billion (up 27% QoQ and 375% YoY) and first-nine-month revenue of NT$194.932 billion, up 290% YoY — all record highs for the respective periods. CEO Pua Khein-Seng said AI Ecosystem modules, including eSSD, aiDAPTIV solution, AI PC, AI Networking, AI Server and Boot Drive, accounted for more than 50% of September revenue. He also said deployments of the company's AI Data Platform in medical settings reached 90% user satisfaction, with document production time in some workflows cut by more than 50%.

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5. Oct 8
   TPCA Show 2026 spotlights energy-efficient AI, advanced packaging

   Taiwan's Printed Circuit Association (TPCA) says its 27th TPCA Show, running Oct 20–22 at Nangang Exhibition Hall 1, will focus on "Energy-Efficient AI: From Computing to Systems and Applications," with more than 680 international brands, 1,840+ booths and a projected 70,000 professional buyers. The co-located 21st IMPACT-IAAC conference opens Oct 19 at the Grand Hilai Taipei and is expected to feature nearly 350 technical presentations and more than 1,500 industry and academic attendees, expanding for the first time to two Nangang halls. Sessions centre on AI computing and system integration, next-generation packaging and substrates (glass substrates, panel-level packaging, hybrid bonding, chiplets), and thermal management, reliability and smart manufacturing.

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