Ningbo Institute of Materials Technology & Engineering

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   Synthetic Diamond Cooling Targets AI Chip Heat and Supply-Chain Risk

   TechNews reports that synthetic diamond and diamond-copper cooling could help address the heat generated by AI computing, as the International Energy Agency estimates data-center electricity consumption could more than double to about 945 TWh by 2030. It cites research by TSMC and Huawei into synthetic-diamond chip cooling, Lenovo’s launch of a China-market laptop with a claimed diamond-copper cooling system, and a Chinese Academy of Sciences institute’s report that a cooling module raised chip-module heat-transfer efficiency by 80%. Reuters also reported that China’s dominant position in synthetic-diamond production could expose the United States to supply-chain risk, while large-scale diamond-wafer manufacturing still requires higher purity and production standards.

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