Synthetic Diamond Cooling Targets AI Chip Heat and Supply-Chain Risk
TechNews reports that synthetic diamond and diamond-copper cooling could help address the heat generated by AI computing, as the International Energy Agency estimates data-center electricity consumption could more than double to about 945 TWh by 2030. It cites research by TSMC and Huawei into synthetic-diamond chip cooling, Lenovo’s launch of a China-market laptop with a claimed diamond-copper cooling system, and a Chinese Academy of Sciences institute’s report that a cooling module raised chip-module heat-transfer efficiency by 80%. Reuters also reported that China’s dominant position in synthetic-diamond production could expose the United States to supply-chain risk, while large-scale diamond-wafer manufacturing still requires higher purity and production standards.
Diamond-based cooling could address a significant AI-infrastructure constraint while linking chipmakers to a strategic material supply chain, but the cited performance figures and product claims remain vendor-attributed or secondary-source.
在 AI 浪潮帶動下，人造鑽石可望成為美中科技角力的下一個戰略重心。路透社報導，由於 AI 運算會產生大量熱能，產業將日益仰賴鑽石來散熱，而中國在人造鑽石生產上占據主導地位，美國恐面臨供應鏈威脅。
根據國際能源總署（IEA）2025年的一份報告，估計到2030年，資料中心的耗電量將增加一倍以上，達到約945太瓦時（TWh），相當於日本一整年的用電量，而AI是最主要的耗電來源。
#TSMC#Huawei#Lenovo#Intel#Diamond Foundry#Chinese Academy of Sciences#Ningbo Institute of Materials Technology & Engineering#International Energy Agency