Morgan Stanley: Microsoft Maia 300 to begin formal deployment in 2027
A new Morgan Stanley report calls Microsoft's Maia 300 the most important new development at the OCP summit, saying Microsoft is scaling toward a multi-gigawatt target and expects to begin formal Maia 300 deployment in 2027; it names Foxconn and Wiwynn as possible ODM partners and, based on trial production, points to ISU Petasys for accelerator PCBs, Auras for fans and Fositek and Staubli for quick-disconnect connectors. The report also says NVIDIA VR200 racks have started small-volume production, Groq 3 LPX racks are expected between late 2026 and early 2027, standalone Vera CPU racks in late Q1 to early Q2 2027, and AMD's largely unchanged Helios platform should ramp racks in Q1 2027. On components, Morgan Stanley says timing for PTFE, next-generation interconnect and ZQD liquid-cooling connectors on NVIDIA MGX remains unclear, with PTFE promising better signal transmission and less reliance on Q-glass but facing processing complexity, cost and yield/certification risks.
Morgan Stanley's report labels Microsoft Maia 300 the most important new development at the show and says Microsoft is expanding toward a multi-gigawatt deployment goal.
美系外資摩根士丹利（大摩）出具最新報告指出，微軟 Maia 300 是本次展會最重要的新進展；相較之下，NVIDIA 與 AMD 展出的系統級硬體新品有限。NVIDIA MGX 的零組件升級是供應鏈主要觀察重點，但 PTFE（聚四氟乙烯）、次世代互連技術及冷卻連接器（ZQD）的導入時程仍不明朗。
大摩指出，NVIDIA VR200 機櫃已開始小量放產，NVIDIA Groq 3 LPX 機櫃預計於 2026 年底至 2027 年初接續推出，而獨立式 Vera CPU 機櫃則預計於 2027 年第一季末至第二季初開始出貨；至於 AMD，根據近期調查，Helios 平台並無太大變化，機櫃預計於 2027 年第一季開始放量。
#Microsoft#Microsoft Maia 300#NVIDIA#NVIDIA Vera CPU#AMD#AMD Helios#Morgan Stanley#Foxconn#Wiwynn