AMD Helios

Headlines · 3

1. 4d
   AMD unveils Helion agentic AI rack design; Helios racks enter production

   At the OCP Global Summit 2026, AMD chair and CEO Lisa Su introduced Helion, an open rack-scale reference design for agentic AI workloads built to OCP's Open Rack v3 (ORv3) 44OU specification, with configurations planned for availability in November 2026 and specs to be submitted to the OCP community. AMD says Helion comes in CPU-only and CPU-GPU configurations supporting up to 32,768 Zen 6 CPU cores, 16 Instinct MI350P accelerators, 74 petaflops of FP4 compute and 102 Tbps of networking, with Venice CPU and power options split across personal-assistant, enterprise and technical-computing agent workloads, plus an integrated token router that directs agent model requests across frontier and open-source models. AMD also said its Helios AI rack, first shown at OCP last year, has entered production, with the first systems installed and running at OpenAI, Meta, Microsoft and Oracle; Helios combines Instinct GPUs, EPYC processors, Pensando networking and the ROCm software stack.

   科技新报 · 🔥 5
2. 6d
   Samsung offers memory as leverage for AMD foundry orders; AMD stays cautious

   AMD CEO Lisa Su visited South Korea to secure stable high-bandwidth memory (HBM) supply for its AI accelerators and said she would discuss a broader partnership with Samsung executives. Samsung hopes to use its memory supply as leverage to win foundry production of AMD's advanced logic chips; according to Korean outlet THE ELEC, the two firms signed a three-year, non-binding MOU in March 2026 covering HBM4 and advanced DDR5 supply, joint memory optimization for AI and HPC, evaluation of AMD platforms made at Samsung foundry, and advanced packaging cooperation. Su also confirmed AMD has begun shipping next-generation Instinct MI455 chips with 432GB of HBM4 and Helios AI rack systems, with Samsung currently the main HBM4 supplier for the MI400 series, though AMD warned in its latest annual report that shifting production to a new foundry could bring delays, lower yields or weaker performance.

   科技新报 · 🔥 0
3. Oct 7
   Lisa Su in Korea to lock in HBM supply, seeks broader Samsung partnership

   At AMD Gamer Day in Seoul on Oct 7, CEO Lisa Su called South Korea's semiconductor supply chain "indispensable" and said AMD wants three- to five-year (or longer) memory supply arrangements with Samsung Electronics and SK hynix to cope with tight HBM supply, while working with customers to optimize memory usage. She met Samsung's device solutions chief and vice chairman Jun Young-hyun and other executives that day; Taiwan's TechNews reports she also said AMD has begun shipping its next-gen MI455 accelerators and Helios systems using HBM4, backed by Samsung and SK hynix. Reports say Samsung hopes to convert the memory relationship into foundry orders, but Su only spoke of "exploring" memory and foundry cooperation, and neither company disclosed details.

   36氪快讯 · 🔥 0

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