AMD unveils Helion agentic AI rack design; Helios racks enter production
At the OCP Global Summit 2026, AMD chair and CEO Lisa Su introduced Helion, an open rack-scale reference design for agentic AI workloads built to OCP's Open Rack v3 (ORv3) 44OU specification, with configurations planned for availability in November 2026 and specs to be submitted to the OCP community. AMD says Helion comes in CPU-only and CPU-GPU configurations supporting up to 32,768 Zen 6 CPU cores, 16 Instinct MI350P accelerators, 74 petaflops of FP4 compute and 102 Tbps of networking, with Venice CPU and power options split across personal-assistant, enterprise and technical-computing agent workloads, plus an integrated token router that directs agent model requests across frontier and open-source models. AMD also said its Helios AI rack, first shown at OCP last year, has entered production, with the first systems installed and running at OpenAI, Meta, Microsoft and Oracle; Helios combines Instinct GPUs, EPYC processors, Pensando networking and the ROCm software stack.
It shows agentic workloads being treated as a distinct data-center category, and suggests traditional facilities may face power and cooling retrofits.