TSMC Chairman and CEO C.C. Wei said on the company's fiscal third-quarter earnings call that TSMC has begun mass production of 5x-reticle advanced packaging with “very excellent” yields, claiming no other company can currently match that scale and that customers are satisfied with the results. He said TSMC is developing 9x-reticle packaging and pushing toward 14x; without naming Intel's EMIB or other competing approaches, he said TSMC would be ready if customers cannot secure enough advanced packaging capacity from competitors. IT之家's explainer notes that AI and high-performance computing chips increasingly rely on packaging multiple compute dies and high-bandwidth memory on one large substrate, so larger package areas usually allow more compute, memory and interconnect density but make yields harder to guarantee; the report separately cites Anue's August report that 5.5x-reticle CoWoS is in high-volume production with some customer yields above 98%, and that TSMC plans to extend CoWoS beyond 14x by 2029.