TechNews

Headlines · 2

1. Oct 18
   Intel calls silicon photonics next-gen 'Golden Hammer', claims sole 300mm InP volume fab

   At the 2026 OCP Global Summit, Intel data center systems vice president Nic Dubé described silicon photonics as the "Golden Hammer" of next-generation system architecture, saying it will accelerate high-performance segments including HPC and AI. Intel claims it is the only high-volume fab able to supply 300mm (12-inch) indium phosphide silicon photonics at scale, citing a unique track record in integrated laser reliability, and says it is pushing community standards for external light sources. Intel estimates photonics systems can reach transmission energy below roughly 5 picojoules per bit (IT之家 reported under 5.5 pJ/bit), and says it will offer advanced interconnect topologies with runtime orchestration of CPUs, GPUs and memory pools as AI models grow. The exclusivity and efficiency figures are Intel's own claims and were not independently verified in the reports.

   Wccftech · 🔥 0
2. Oct 16
   TSMC starts mass production of 5x-reticle advanced packaging

   TSMC Chairman and CEO C.C. Wei said on the company's fiscal third-quarter earnings call that TSMC has begun mass production of 5x-reticle advanced packaging with “very excellent” yields, claiming no other company can currently match that scale and that customers are satisfied with the results. He said TSMC is developing 9x-reticle packaging and pushing toward 14x; without naming Intel's EMIB or other competing approaches, he said TSMC would be ready if customers cannot secure enough advanced packaging capacity from competitors. IT之家's explainer notes that AI and high-performance computing chips increasingly rely on packaging multiple compute dies and high-bandwidth memory on one large substrate, so larger package areas usually allow more compute, memory and interconnect density but make yields harder to guarantee; the report separately cites Anue's August report that 5.5x-reticle CoWoS is in high-volume production with some customer yields above 98%, and that TSMC plans to extend CoWoS beyond 14x by 2029.

   IT之家 AI · 🔥 0

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