Infineon

Headlines · 6

1. 11h
   Morgan Stanley: OCP summit spotlights optics, 800VDC, hardware security

   Morgan Stanley issued an industry report on the Open Compute Project Global Summit identifying three core technology shifts: upgraded optical interconnect architectures, a move to 800VDC high-voltage DC power with liquid cooling, and chip-level telemetry with hardware root-of-trust upgrades. The report cites Accton and Celestica showing 1.6T switches based on Broadcom's Tomahawk 6, and an Nvidia-Delta power blueprint in which a single 660kW 800VDC power rack supports two Vera Rubin NVL72 compute racks. It also names Taiwan suppliers including BizLink, Chroma, Delta, ASPEED and eMemory as poised to benefit from the transition.

   科技新报 · 🔥 7
2. 1d
   NextGO Epi bets on gallium oxide epiwafers to cut AI data-center power losses

   Taiwanese founder Chou Ta-shun started Berlin-based NextGO Epi in 2025 with two German partners; the company makes gallium oxide epiwafers and claims to be Europe's only producer able to mass-produce 4-inch gallium oxide epiwafers at industrial quality, and it closed a €2 million pre-seed round in July 2026. Because power-semiconductor giants such as Infineon and Bosch do not yet have gallium oxide device lines, NextGO Epi currently pays foundries in Germany, the US and Taiwan to turn its epiwafers into devices for customers; Chou originally expected the market to open around 2030 but now expects foundries to take on gallium oxide devices by 2028 as AI power demand grows. The report notes that gallium oxide still lacks practical P-type doping and has lower thermal conductivity than silicon carbide, which Chou says can be worked around through device design and heterogeneous material bonding; he also says its 4.9 eV bandgap could theoretically yield device resistance one-fifth to one-tenth that of comparable SiC or GaN parts.

   科技新报 · 🔥 4
3. 5d
   MemSilicon tapes out MountTai 2026, a 1Gb RRAM chip

   MemSilicon said on October 12 that it completed tape-out of MountTai 2026, its first high-density, large-capacity RRAM chip built on a 1TnR cell approach, and is now moving to verification. The chip uses a 28nm CMOS platform and a 1T4R structure — one select transistor shared by four resistive memory cells — with 1Gb per die, a density of 30Mb/mm², access latency under 20ns and on-chip hardware error correction. MemSilicon says the device balances large capacity, high density and fast reads, and is pursuing three product lines: embedded RRAM IP, high-density large-capacity RRAM, and hybrid compute-in-memory combining RRAM with DRAM.

   量子位（原生 RSS） · 🔥 0
4. 7d
   GlobalFoundries unveils 7nm-class FDX Fusion FD-SOI node for edge AI, production in 2028

   GlobalFoundries announced FDX Fusion, a new FD-SOI platform unveiled in Dresden, Germany, claiming 7nm-class digital performance and more than double the logic density of its 22FDX process introduced in 2015, aimed at automotive, industrial, robotics, sensors and edge AI applications that prioritize low power and high integration. The technology combines planar transistors, FD-SOI substrates and back-end interconnect innovations, and supports RF, analog and mixed-signal circuitry, embedded nonvolatile memory and in-memory computing, with processor IP planned for MIPS, ARC and RISC-V architectures. GlobalFoundries plans initial demo silicon in early 2027, a first PDK in mid-2027 and production in Dresden in 2028; BMW, Bosch, Infineon, NXP, Siemens and Tesla expressed interest, though only Infineon confirmed collaboration on future 7nm-class technology for radar and wireless communications.

   Tom’s Hardware · 🔥 0
5. Oct 11
   US ITC opens patent probe into Foxconn, Luxshare, 18 others over AI server power

   The US International Trade Commission has opened a patent case against 20 companies, including Foxconn, Luxshare, Quanta, Delta Electronics, Monolithic Power Systems, Infineon, Flex and Celestica, over the power systems that feed top-end chips from directly below them inside AI servers, and the computers that use them. The action follows a complaint by power-chip maker Vicor, which claims their products infringe one of its patents and wants them barred from the US with the firms ordered to stop selling them. Luxshare said it does not expect a material impact, noting the products are still being tested by customers and are not in mass production, while the commission has not ruled and will set a target completion date within 45 days; any import ban could only take effect after a full hearing and final ruling.

   The Next Web · 🔥 0
6. Oct 10
   Vicor files third Section 337 case, naming 20 AI server supply-chain firms

   The US International Trade Commission opened case 337-TA-1526 on October 9, with power-module maker Vicor accusing 20 companies — including Luxshare Precision, Foxconn, Infineon and Delta Electronics — of infringing patents covering vertical power delivery (VPD). The article says this is Vicor's third Section 337 action in the AI power space, and that its quarterly licensing revenue reached $30.4 million in Q2 versus $10.4 million a year earlier, while a parallel federal suit against MPS (7:26-cv-00364) was filed a day before the ITC complaint. The author expects the case to take roughly 16–18 months and most likely end in a licensing settlement, noting that any exclusion order would only affect US customs, leaving sales outside the US unaffected.

   虎嗅 AI · 🔥 0

Experience and discussion from the community

Share my Infineon experienceAsk about Infineon