GlobalFoundries unveils 7nm-class FDX Fusion FD-SOI node for edge AI, production in 2028
GlobalFoundries announced FDX Fusion, a new FD-SOI platform unveiled in Dresden, Germany, claiming 7nm-class digital performance and more than double the logic density of its 22FDX process introduced in 2015, aimed at automotive, industrial, robotics, sensors and edge AI applications that prioritize low power and high integration. The technology combines planar transistors, FD-SOI substrates and back-end interconnect innovations, and supports RF, analog and mixed-signal circuitry, embedded nonvolatile memory and in-memory computing, with processor IP planned for MIPS, ARC and RISC-V architectures. GlobalFoundries plans initial demo silicon in early 2027, a first PDK in mid-2027 and production in Dresden in 2028; BMW, Bosch, Infineon, NXP, Siemens and Tesla expressed interest, though only Infineon confirmed collaboration on future 7nm-class technology for radar and wireless communications.
If delivered on schedule, FDX Fusion could give European automotive and edge-AI chip designers a more advanced locally made process and an alternative to FinFET for workloads that don't need peak performance — but GF has disclosed no transistor dimensions or density figures, so the claim remains unverified.