Morgan Stanley: OCP summit spotlights optics, 800VDC, hardware security
Morgan Stanley issued an industry report on the Open Compute Project Global Summit identifying three core technology shifts: upgraded optical interconnect architectures, a move to 800VDC high-voltage DC power with liquid cooling, and chip-level telemetry with hardware root-of-trust upgrades. The report cites Accton and Celestica showing 1.6T switches based on Broadcom's Tomahawk 6, and an Nvidia-Delta power blueprint in which a single 660kW 800VDC power rack supports two Vera Rubin NVL72 compute racks. It also names Taiwan suppliers including BizLink, Chroma, Delta, ASPEED and eMemory as poised to benefit from the transition.
The report says AI rack power has climbed from tens of kW to hundreds of kW, making power delivery and interconnect architecture central to AI infrastructure planning.
隨著人工智慧（AI）算力需求呈現爆炸式成長，日前開放運算計畫（OCP）全球峰會正式登場。對此，外資摩根士丹利（Morgan Stanley；大摩）出具最新產業研究報告指出，本次峰會涵蓋三大核心技術變革，包括光互連傳輸架構躍升、800VDC 高壓供電與液冷轉型，以及晶片級遙測管理與硬體安全根（RoT）升級等。各領域的發展都攸關未來人工智慧基礎建設布局，值得投資人關注。
1.6T 時代臨門，NPO/IPO 崛起與微型 VCSEL 方案躍居新寵
隨著 AI 交換機與伺服器集群頻寬全面邁向 1.6T，智邦（Accton）與 Celestica 等廠商展出了基於 Broadcom Tomahawk 6 晶片的 1.6T 網路交換機。傳統可插拔光模組在高速傳輸下遭遇功耗瓶頸，而共封裝光學（CPO）雖具備低功耗與高頻寬密度優勢，但因製造良率與維修便利性（Serviceability）等問題，短期內全面普及仍面臨挑戰。
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