Hikray, a Hikvision unit, unveiled a high-precision 3D AXI inspection system for semiconductor packaging at this year's industry fair, saying it achieves sub-micron X-ray measurement, 3D image reconstruction and defect analysis while extending the business into advanced packaging and lab-grade failure analysis. President Wang Wei told 36Kr that AI plus X-ray is the sector's new variable, moving inspection from sampling to full inspection; built on Hikvision's Guanlan model, a brand-new product category can be modelled from one to two hundred images, and around ten images suffice to transfer an existing model to a new variant. He cited X-ray plus AI hinge inspection that cut defect rates by an order of magnitude and food inspection that detects bones about 1 mm thin and estimates fat ratio; the company says it now ranks in China's top three in several niche equipment segments and calls overseas markets a priority.