Samsung Reportedly Covers 70% of Generic DRAM Capacity and All 2027 HBM Orders
cnBeta, citing Korean media and a securities analysis report, says Samsung Electronics signed five-year memory supply agreements with major global technology companies. The reported agreements cover about 70% of Samsung's generic DRAM capacity and all HBM planned for production in 2027. Customers are reportedly competing for the roughly 30% of generic DRAM capacity not secured through long-term contracts. Pricing and profit figures cited in the reports are institutional estimates rather than Samsung guidance.
The reported long-term agreements could give Samsung greater order visibility and help it plan capacity, investment and product mix. The report also says AI data-center expansion is associated with tight memory supply, while long-term contracts cannot eliminate market risk or guarantee fixed prices.
全球人工智能基础设施建设持续推高内存需求，三星电子正在通过长期供应协议，提前锁定未来数年的销售规模。据韩国媒体援引证券分析报告称，三星已经与全球大型科技企业签订大规模内存供应协议，约70%的通用DRAM产能通过长期合同获得保障，而2027年计划生产的高带宽内存（HBM）则已全部获得订单。随着内存供应持续紧张，相关产品价格预计还将进一步上涨，这有望推动三星半导体业务利润增长，但也可能增加智能手机、平板电脑和其他消费电子产品的制造成本。
根据GSMArena于2026年10月20日发布的报道，韩国联合通讯社此前披露，三星已与全球大型科技企业签订为期五年的内存供应合同。相关协议覆盖三星大部分通用DRAM供应，以及2027年计划生产的全部HBM产品。对于尚未通过长期合同锁定的约30%通用DRAM产能，市场需求仍然十分旺盛，多个客户正在争取剩余供应。