Beijing-based AI chip startup Suanmiao Technology announced on October 14 that it closed Pre-A2 and A funding rounds, bringing its total raised over the past year to nearly 2 billion yuan, DoNews reported. The rounds were led by Yizhuang Guotou and other Beijing municipal and district state-owned investment platforms, with proceeds earmarked for hiring R&D staff, iterating core technology and accelerating mass production of its self-developed 3D TokenPU compute chip for large-model workloads. Founded in November 2022 and headquartered in Beijing's Daxing district, the company focuses on cloud chips for large-model inference; it says its 3D TokenPU architecture stacks a memory wafer vertically on a logic wafer via 3D hybrid bonding to break the traditional "memory wall," using relatively mature domestic process nodes and supply chains. In February it announced Pre-A and Pre-A1 rounds totaling close to 1 billion yuan.