Korea chip show opens Oct 14 with HBM4E, physical AI chips in focus
South Korea's semiconductor industry association said the 28th Korea Semiconductor Exhibition (SEDEX 2026) will run Oct 14-16 at COEX in Gangnam, Seoul, under the theme "Into the Era of Silicon Intelligence," with 300 companies and 888 booths, a record size. Samsung Electronics will show next-generation memory structures and products for cloud, edge computing and physical AI, including high bandwidth memory (HBM), mobile image sensors, mobile processors, high-reliability automotive chips, foundry solutions and 3D memory structures. SK Hynix will unveil next-generation memory technologies including seventh-generation HBM (HBM4E) and high bandwidth flash (HBF), alongside flagship server, PC and mobile DRAM, NAND flash and SSD products; Korean materials, parts and equipment makers such as Jusung Engineering, SEMES and Hanmi Semiconductor will also exhibit.
HBM and chips aimed at physical AI sit at the center of today's AI compute supply chain, so the show offers a read on the pace of next-generation AI hardware supply.