SEDEX 2026

Headlines · 2

1. 3d
   SK hynix forecasts ~20x AI infrastructure performance growth by 2030

   Speaking at the 28th Korea Semiconductor Exhibition (SEDEX 2026) in Seoul, SK hynix head of development Ahn Hyun predicted that AI infrastructure performance scale will grow about 20-fold by 2030, according to Yonhap. He said the AI inference market is expanding along three axes at once — rising task complexity, surging context length and a flood of inference requests — inflating KV Cache capacity and forcing data to be spread across HBM, DRAM and SSD, with the resulting data movement becoming a new bottleneck for performance and power. Beyond tuning existing HBM, SK hynix is developing 3D-stacked DRAM that places DRAM directly atop logic chips such as GPUs and NPUs, and High Bandwidth Flash (HBF) that brings through-silicon-via stacking and high-speed I/O to NAND, targeting roughly 50% of same-generation HBM bandwidth with about 10x the capacity.

   IT之家 AI · 🔥 0
2. 5d
   Korea chip show opens Oct 14 with HBM4E, physical AI chips in focus

   South Korea's semiconductor industry association said the 28th Korea Semiconductor Exhibition (SEDEX 2026) will run Oct 14-16 at COEX in Gangnam, Seoul, under the theme "Into the Era of Silicon Intelligence," with 300 companies and 888 booths, a record size. Samsung Electronics will show next-generation memory structures and products for cloud, edge computing and physical AI, including high bandwidth memory (HBM), mobile image sensors, mobile processors, high-reliability automotive chips, foundry solutions and 3D memory structures. SK Hynix will unveil next-generation memory technologies including seventh-generation HBM (HBM4E) and high bandwidth flash (HBF), alongside flagship server, PC and mobile DRAM, NAND flash and SSD products; Korean materials, parts and equipment makers such as Jusung Engineering, SEMES and Hanmi Semiconductor will also exhibit.

   36氪快讯 · 🔥 0

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