imec

Headlines · 2

1. 23h
   Lam Research and imec Expand 3D Integration and Aether Collaboration

   Lam Research and imec expanded their collaboration with joint research on advanced 3D integration, next-generation 3D memory processes, and Aether dry resist for High-NA EUV lithography, according to TechNews. The 3D integration work covers dielectric deposition, stress compensation, bevel deposition, plasma dicing, and process validation, while the memory effort includes charge-trapping materials, multilayer deposition, high-aspect-ratio etching, contacts, and low-resistance interconnects. Lam Research said earlier joint work used single-exposure High-NA EUV lithography to pattern ruthenium direct-metal-etch interconnects at line pitches below 20 nanometers, with reported electrical yields of 100% for fork structures and above 90% for meander structures.

   科技新报 · 🔥 5
2. Oct 23
   Five partners plan 2nm low-power AI chip for medical imaging

   LSTC, Hokkaido University, Fujifilm, GE HealthCare and imec announced they will undertake a NEDO project to develop a 2nm low-power AI inference chip for medical imaging. The team plans to develop and optimize workloads on IBM Spyre before migrating them to the chip, with intended uses including photon-counting CT reconstruction, real-time ultrasound image overlay and surgical-image recognition. The development targets are more than five times the image-processing speed and ten times the energy efficiency of existing GPUs, followed by clinical use at Hokkaido University Hospital; these performance figures are unverified targets, not independent measurements.

   IT之家 AI · 🔥 0

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