Samsung Electro-Mechanics
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Headlines · 5
- Murata Plans ¥1 Trillion MLCC Expansion for AI Data Centers
Murata Manufacturing plans to invest ¥1 trillion over five years to more than double MLCC capacitor sales and meet demand from AI data center operators, according to IT之家 AI. The company also plans to invest an additional ¥80 billion over two years to raise capacity by 15%, while raising its current fiscal-year operating profit guidance to ¥520 billion. Murata said existing expansion plans could no longer accommodate all orders.
IT之家 AI · 🔥 3 - AI Demand Reportedly Strains PCB and Chip Substrate Supply
AI data-center demand is reportedly diverting PCB and chip-substrate production capacity from PC and consumer-electronics makers. Nikkei Asia reports that some PCB lead times have stretched to 30 months, copper-clad laminate costs have risen at least 12-fold since July 2026, and one major supplier's order book extends into 2030.
Tom’s Hardware · 🔥 19 - Samsung Electro-Mechanics Posts Record Q3 Results on AI Demand
Samsung Electro-Mechanics reported record quarterly revenue and operating profit, citing strong demand for AI infrastructure-related products. Regulatory filings showed operating profit of 691 billion won for July through September, up 165.5% year over year, while revenue rose 30.3% to 3.76 trillion won.
36氪快讯 · 🔥 0 - Tesla and Samsung Electro-Mechanics reportedly back FC-BGA expansion
Tesla and NVIDIA are reportedly funding Samsung Electro-Mechanics to expand FC-BGA substrate production for AI chips, with reported total funding of 3.7 trillion won, or about $2.8 billion in another account. Tesla also reportedly signed a five-year supply agreement covering substrates for its electric vehicles and Optimus humanoid robots, while the dedicated Sejong facility is expected to begin mass production in late 2028 and ship in 2029. The claims come from TrendForce, Maekyung and industry news rather than direct company announcements.
36氪快讯 · 🔥 0 - NVIDIA Funds Six-Supplier AI Infrastructure Capacity Expansion
NVIDIA announced capacity-reservation agreements with six supply-chain partners to expand substrates, advanced packaging, semiconductor testing and optical-engine capacity for its accelerated-computing and full-stack AI factory platforms. The company and its suppliers target a 2.5-fold increase in relevant substrate capacity over three years, while Amkor plans more than 300% greater advanced-packaging capacity by the end of 2028. NVIDIA will provide KYEC with a $1.1 billion capacity-reservation advance for U.S. testing facilities, and SPIL targets a 15-fold increase in co-packaged-optics engine capacity by mid-2027.
NVIDIA Newsroom · 🔥 0
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