Huawei Mate 90 Pro Max

Headlines · 2

1. 4d
   Huawei Mate 90 series launches with Kirin 9050 Pro logic-folding chip

   Huawei introduced the Mate 90 series with the Kirin 9030, Kirin 9035 and Kirin 9050 Pro chips, alongside displays, imaging and communication upgrades. According to IT之家 and 智东西, the Kirin 9050 Pro combines Lingxi CPU, Maliang GPU and a Da Vinci NPU that Huawei says can deploy a 30B-parameter mixture-of-experts model on-device. Huawei also claimed overall performance gains of 27% for Mate 90, 20% for Mate 90 Pro and 31% for Mate 90 Pro Max, but no independent test results were reported.

   智东西 · 🔥 0
2. Oct 12
   Huawei details Kirin 9050 Pro, its first logic-folded chip, with on-device 30B MoE

   At a 2026 Kirin media briefing in Shanghai on Oct 13, Huawei semiconductor executive Xu Songyu published the full architecture diagram of the Kirin 9050 Pro, the first logic-folded "Tao" chip, which Huawei says has been mass-produced with support from China's semiconductor industry. The chip combines a new Lingxi CPU (9 cores, 16 threads), a fourth-generation Maleoon GPU with second-generation hardware ray tracing (40% higher performance, 45% lower power, 78% better ray tracing), a new Da Vinci NPU, a Kirin AI ISP, a Balong AI Modem, an FFTS function-flow task scheduler, a security processor and the Lingxi micro-core. Huawei says the NPU raises AI performance by 140% while cutting power by 66% and enables the industry's first on-device 30B MoE model (2B active parameters, under 2.5GB of memory), alongside 7B dense and 1B VLM models; Xu also said the next-generation Kirin 2027 chip is ready and that all test results so far meet expectations.

   IT之家 AI · 🔥 0

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