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HiSilicon

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Headlines · 3

  1. Qualcomm to pay Huawei under patent cross-license, says analysis

    An analysis published by TMTPost (authored by Shi Tianhao) says Huawei and Qualcomm reached a multi-year, broad patent licensing agreement covering cross-licenses in 5G, computing, AI and networking, with Qualcomm also acquiring some of Huawei's US patents in computing, AI and networking. Citing CCTV Finance, it says Qualcomm will pay to use more than 680 Huawei patents, and that Huawei's cumulative licensing revenue across all agreements is expected to exceed $6.9 billion (the value of this deal was not disclosed); Qualcomm has denied being a "net payer" and denied the transaction involves "logic folding." The piece sets the deal in a 25-year timeline in which Huawei, once the payer, has become a payee, contrasts the Kirin 9050 Pro's "logic folding" and Taifa with Xiaomi's XRING O1, and notes claims that Ascend's China market share has passed Nvidia, that DeepSeek is co-developing open-source software tooling for Ascend, and that AMD is buying World Labs for about $8.2 billion.

    钛媒体 · 🔥 8
  2. HiSilicon's HiSpark launches XDAS framework, digital FAE beta

    Shanghai HiSilicon used an upgrade of its HiSpark developer community to introduce the XDAS four-pillar framework — AI for Development, AI for Application, AI for Support and EXperience for AI — arguing that the developer ecosystem for edge AI needs to be rebuilt around agents. The community has opened a first set of AI Skills spanning five domains, started a 24/7 digital FAE beta, and offers a model/algorithm marketplace plus quantization and compression tools, with an online training platform planned for year-end. Claims such as roughly 76% faster AI-assisted embedded development, over 85% of support questions being repeats, and a 10x download increase as of September 2026 are vendor statements and are not independently verified.

    智东西 · 🔥 4
  3. Qualcomm reportedly to license Huawei patents tied to LogicFolding

    Qualcomm has reportedly agreed to a multiyear cross-license with Huawei that may include patents supporting Huawei’s LogicFolding chip-stacking architecture, Bloomberg reported. The companies’ announcement did not identify the patents or mention LogicFolding; the deal also includes technology areas such as 5G, AI services, optics and networking, and remains subject to regulatory approval.

    Tom’s Hardware · 🔥 0

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