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Qualcomm reportedly to license Huawei patents tied to LogicFolding

AI summary

Qualcomm has reportedly agreed to a multiyear cross-license with Huawei that may include patents supporting Huawei’s LogicFolding chip-stacking architecture, Bloomberg reported. The companies’ announcement did not identify the patents or mention LogicFolding; the deal also includes technology areas such as 5G, AI services, optics and networking, and remains subject to regulatory approval.

In-depth insight

The deal could give Qualcomm access to Huawei chip-stacking IP while signaling the growing importance of advanced packaging and interconnects.

QualcommHuaweiLogicFolding

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