Fractilia

Headlines · 1

1. Oct 23
   China’s DUV Chipmaking Advances Face Rising Cost and Yield Limits

   Chinese chipmakers are using multiple exposures with DUV lithography to produce advanced logic without ASML’s restricted EUV systems, as seen in teardowns of Huawei’s Kirin 9000S and Kirin 9030. Experts cited by Tom’s Hardware say additional masks increase overlay risks, manufacturing time, die size and cost, while SMIC’s reported N+3 process remains less scaled than established 5nm processes from TSMC and Samsung. Morgan Stanley estimated that CXMT produces about one-third as many bits per wafer as Western competitors, though the report also cites Micron’s success with tightly controlled DUV multiple patterning for DRAM.

   Tom’s Hardware · 🔥 0

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