ASML
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Headlines · 10
- Broadcom CEO Calls AI Market a 'Casino' as Tech Stocks Slide
Bloomberg's "The Opening Trade" recapped a striking warning this week from Broadcom's CEO, who likened the artificial intelligence market to a "casino." Strong earnings from ASML and a better-than-expected outlook from TSMC followed, but neither was enough to stem a global tech stock rout. Analysts and experts discussed what this says about spending in the booming trade and whether it is becoming an increasingly risky bet.
Bloomberg Technology · 🔥 5 - AI's Real Bottleneck Is Capital, Not Power or Chips, Goldman Warns
CoreWeave shares fell more than 15% on Oct 14, with its $2.75 billion unsecured bond trading below 80 cents on the dollar and five-year credit default swaps at 881 basis points, according to a 36Kr repost of Wall Street CN Max; Oracle, Dell and several data-center names fell sharply the same day. Goldman Sachs estimates hyperscaler capital spending will reach $1.2 trillion next year against roughly $1.1 trillion in operating cash flow, forcing at least 35% of buildout spending — over $400 billion — to be debt-funded, while the 10-year Treasury yield briefly topped 5.3% and AI issuance competes with a near-$2 trillion US fiscal deficit for long-dated money. Broadcom CEO Hock Tan and Intel CEO Lip-Bu Tan said capital and its cost are the biggest constraint, and Goldman warned of a possible semiconductor supply-chain "air pocket" in 2027–2028 if credit tightening delays projects.
36氪 人工智能 · 🔥 4 - ASML reportedly building die-to-wafer hybrid bonding tool, pressuring Besi
SemiAnalysis reports that although ASML has not announced anything publicly, its 27 bonding patent families filed between December 2022 and November 2024, a March news report and its own roadmap all point to it developing a hybrid bonding tool, likely starting with the harder die-to-wafer (D2W) variant. The design differs from traditional bonders: each die rides its own holder along a track, stopping at inspection, cleaning, plasma activation, topography and leveling metrology, and coarse and fine alignment stations before a bonding station where the chuck lifts the bottom wafer to meet the die. SemiAnalysis argues ASML can reuse its lithography expertise in alignment sensing, such as the ORION wafer-alignment sensor, and particle control, but still must solve feed-forward metrology, the die-to-wafer contact, modification of non-bonding tools and loop cleanliness; advanced logic is expected to adopt first, pressuring Besi, currently the only supplier with D2W tools in volume production.
SemiAnalysis · 🔥 3 - Jensen Huang: China's compute shortage pushes AI firms to extreme efficiency
In a long conversation with Lex Fridman, Nvidia CEO Jensen Huang said China's shortage of compute places heavy constraints on its AI companies but pushes them to design highly efficient architectures, and that they keep raising money and pushing forward to "get things done." On export controls, he argued restrictions should be highly selective and cautious, saying long-term national security ultimately rests on prosperity and that technology leadership and economic leadership form a flywheel, with AI being not just a model but a full stack that requires energy. He also recalled writing to TSMC and choosing to work with it for 30 years, saying what won him over was Morris Chang's honesty in saying "we can't do that" and a commitment to long-term partnership.
36氪 人工智能 · 🔥 3 - ASML races to add capacity as AI chip equipment demand stretches years out
On Bloomberg Tech, Intesa Sanpaolo analyst Antonella Frongillo said ASML is rushing to expand capacity as demand for the advanced chipmaking equipment behind the AI boom extends years into the future. She said semiconductor equipment makers are already discussing customer demand for 2029 and 2030, and that she still sees further upside for ASML. She also pointed to uncertainty around ASML's China business and new regulatory restrictions.
Bloomberg Technology · 🔥 0 - ASML's strong orders ease fears the AI spending boom is running out of steam
Reuters reports that ASML posted strong orders, with the article's headline indicating fourth-quarter sales guidance above expectations on AI chip demand. The result eases concerns that the AI capital-spending boom may be losing momentum. The item drew 100-plus points and discussion on Hacker News' AI section, though the supplied source data contains only the headline and a comments link, with no specific order or guidance figures.
Hacker News · AI（100+ 分） · 🔥 0 - Cerebras: fast inference, slow delivery as OpenAI ties draw scrutiny
OpenAI CEO Sam Altman recently posted on social media describing Cerebras as a partner, with the two working on the frontier of inference speed, and Cerebras shares rebounded in premarket trading; the move followed a sharp drop reportedly triggered by word that OpenAI used Nvidia chips for the Ultrafast mode of GPT-6.1 Sol. Citing disclosed figures, the article says Cerebras reported roughly $510 million in fiscal 2025 revenue, up about 75.7% year over year, with $237.8 million in net profit; second-quarter cloud revenue reached $126 million, up 52% quarter over quarter, including $56.8 million recognized from OpenAI, about 32% of quarterly revenue. It also notes about $392.8 million in negative free cash flow and a roughly $25.4 billion backlog as of end-June, of which only about 22% is expected to be recognized within 24 months and 43% in months 25–48, while the top three customers accounted for 76% of second-quarter revenue.
MIT科技评论中文 · 🔥 0 - ASML raises 2026 sales outlook as AI demand outstrips capacity
ASML raised its 2026 full-year sales forecast on October 14, lifting the low end of the range to €44 billion–€45 billion, citing soaring artificial intelligence spending that is driving demand for its chipmaking machines. The company said its currently planned supply capacity for 2027 and 2028 will still not fully meet customer demand, and that some customers have begun talks about equipment orders for 2029 and even 2030. ASML said it is studying ways to further increase 2028 capacity beyond the previously announced 30% expansion, and guided fourth-quarter revenue of €14.2 billion–€15.2 billion, after third-quarter net sales of €11.66 billion and net profit of €4.96 billion.
36氪快讯 · 🔥 6 - Analysis: Nvidia, TSMC, ASML and Broadcom as AI's chip 'shovel sellers'
An analysis republished by 36Kr (from the WeChat account Tech Business) maps the AI compute supply chain as a power pyramid: Arm's architecture licensing at the top of the value chain, then GPU/ASIC design at Nvidia and AMD plus Broadcom's custom XPUs and networking chips, then advanced-node foundry work at TSMC, all resting on ASML as the sole supplier of EUV lithography. It cites figures including Nvidia's latest-quarter revenue of $96.2 billion with $89 billion from data centers, Broadcom's AI semiconductor revenue of $16.7 billion up 221% year over year, and TSMC's second-quarter revenue of $40.2 billion with 2nm beginning to contribute. The author argues that roughly $725 billion of combined 2026 capital spending by Microsoft, Google, Amazon and Meta fuels a loop in which better chips enable bigger models, which justify larger orders, while warning that these valuations rest on the assumption that AI investment returns will materialize, with supply-demand mismatch and in-house ASIC efforts as key risks.
36氪 人工智能 · 🔥 0 - ASML Q3 preview: AI chip demand expected to nearly double EPS
ASML is scheduled to report third-quarter results on October 14, with the market expecting sharp year-over-year growth in revenue and profit driven by demand for AI chips. In the second quarter, revenue reached €9.3 billion and net profit €2.9 billion, up from €7.7 billion and €2.3 billion a year earlier; the company guided third-quarter revenue to €11–12 billion at a 55%–57% gross margin and raised its full-year revenue outlook to €43–45 billion. Wall Street analysts expect third-quarter revenue of €11.73 billion, up 55% year over year, and EPS of €10.76, roughly double the €5.49 reported in the same quarter of 2025. ASML is the only company commercially producing EUV lithography systems; Intel has processed more than one million wafers using High-NA EUV, Samsung plans to bring the technology into advanced DRAM mass production in 2028, and ASML aims to expand existing EUV capacity by about 30% by 2027.
科技新报 · 🔥 0
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