Qualcomm has completed testing the first chips built with its High Bandwidth Compute (HBC) memory technology, clearing a key step towards using it in data centre AI hardware. The company announced the results, saying the technology will feature in its Dragonfly AI250 accelerator, designed to run AI models in data centres.

Best known for its Snapdragon smartphone chips, Qualcomm introduced the Dragonfly brand for its data centre products in June. HBC is designed to address one of the main bottlenecks in running large language models at scale: moving data quickly enough between memory and processors.