Dragonfly AI300

Headlines · 1

1. Nov 2
   Qualcomm validates first-generation HBC silicon for Dragonfly AI250

   Qualcomm says its first-generation High Bandwidth Compute silicon completed hardware validation at its San Diego laboratory, including the full memory read-and-write path and near-memory computations. The company has taped out a data-center product using the architecture for the Dragonfly AI250 accelerator, which is expected to begin sampling in the first half of 2027. Qualcomm reports 133 TB/s of effective memory bandwidth for AI250, while its comparisons with LPDDR5X and projected HBM4 specifications are vendor-generated estimates rather than independent benchmarks.

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