Foxconn shows NVIDIA Vera Rubin rack platform at OCP 2026
At the 2026 OCP Global Summit, Foxconn (Hon Hai) showcased a new generation of AI Rack technology, with its subsidiary Ingrasys displaying the NVIDIA Vera Rubin NVL72 platform alongside NVIDIA Groq 3 LPX Rack and Compute Tray, NVIDIA Vera CPU Rack Compute Tray and the NVIDIA HGX Rubin NVL8 platform, plus what it describes as full product support for NVIDIA Vera Rubin on the NVIDIA MGX architecture. Foxconn said Vera Rubin NVL72 targets frontier model training and large-scale AI inference and can reach up to 10x inference performance per watt versus NVIDIA's Blackwell platform through co-design, while the liquid-cooled Vera CPU Rack fits up to 256 Vera CPUs per rack, supports 22,500 sandboxes and delivers up to 2x performance for agentic AI, reinforcement learning and data processing workloads. FIT also showed 1.6T OSFP and 12.8T XPO optical interconnect platforms, a liquid-cooled busbar system rated up to 480kW and 400A high-current AC whips, and Foxconn said it is working with Intel on Intel Xeon-based rack-scale agentic AI solutions.
It signals that Vera Rubin-era rack-scale AI infrastructure is being lined up by manufacturing and component suppliers, tying frontier training and agentic inference capacity to vertically integrated hardware supply.