英伟达展示 OOI 硅中介层光学封装原型
在 SEMICON West 2026 上，英伟达以「下一代 AI 的光学整合」为题发布研究成果，称已研发出把光学引擎从有机基板移至硅中介层的原型芯片，并将该技术命名为 OOI（Optics-on-Interposer，硅中介层光学封装）。英伟达表示，移除有机基板可带来更高的带宽密度与更低的功耗；按其展出的 200T ASIC 封装对比示意，传统有机基板方案的光学组件布局跨度约 100 毫米，而 OOI 将关键组件集中到约 8 毫米的硅中介层结构内。此外，仍处研究阶段的 DWDM 演示使用 8 个光波长、每个波长 32 Gb/s，实现单根光纤路径 256 Gb/s 的带宽。首席研究科学家 Nikola Nedovic 表示，公司正在为未来产品提出并评估这些技术，同时应对阻碍其商业化的挑战。
英伟达称这类光学整合方案旨在缓解大规模 AI 系统的连接瓶颈，并以更高带宽密度和更低功耗支撑未来芯片与 AI 工厂的扩展。
NVIDIA has developed prototypes of its next-generation CPO and Optical Fiber technologies which will be leveraged by future products.
NVIDIA Aims Advanced CPOs On Future Chips, Moving Optical Engines From Substrates To Interposer
As the industry moves to develop advanced CPO (Co-Packaged Optics) solutions to address AI and compute requirements at scale, researchers at NVIDIA are already developing next-gen solutions that imply a range of advancements compared to existing architectures.
During SEMICON West 2026, NVIDIA presented "Optical Integration for the Next Generation of AI," which discusses how approaches such as co-packaged optics and DWDM (dense wavelength-division multiplexing) can enable tighter integration and help scale connectivity across future AI systems.
Image Source: The Elec
The topic was presented by NVIDIA's Principal Research Scientist, Nikola Nedovic, who has also shared an interesting research paper, titled "Beyond CPO: A Motivation and Approach for Bringing Optics Onto the Silicon Interposer" back in 2023.
#Nvidia#OOI#DWDM#Nikola Nedovic#Feynman#BlueField-5#NVLink 8 CPO#Spectrum 7 204T CPO