Spectrum 7 204T CPO
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- Nvidia shows optics-on-interposer CPO prototypes, DWDM at 256 Gb/s per fiber
At SEMICON West 2026, Nvidia presented work titled "Optical Integration for the Next Generation of AI" and said it has developed prototype chips that move optical engines from the organic substrate onto the silicon interposer, a technology it calls OOI (Optics-on-Interposer). Nvidia says removing the organic substrate can yield higher bandwidth density and lower power consumption; in its 200T ASIC packaging comparison, conventional organic-substrate optics span about 100 mm while OOI concentrates key components within roughly an 8 mm interposer. Separately, a still-research-stage DWDM demo used eight wavelengths at up to 32 Gb/s each to reach 256 Gb/s per optical fiber path. Principal Research Scientist Nikola Nedovic said the company is proposing and evaluating technologies for future products while addressing challenges that prevent commercialization.
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