Analyst: Intel Foveros packaging may land another major foundry deal
GF Securities analysts predict Intel's Foveros advanced packaging technology could win another major foundry contract, with NVIDIA cited as the potential customer and the collaboration possibly taking effect in the second half of 2028, according to cnBeta. The report stresses this is only an analyst forecast: neither NVIDIA nor Intel has confirmed adopting Foveros or announced any order, and which Foveros variant or how much capacity is involved remains unverified. It also notes a September 2026 TrendForce report saying TSMC's CoWoS should remain the mainstream advanced packaging for AI chips through 2028, and that NVIDIA invested $5 billion in Intel in September 2025 under an agreement to develop joint products across multiple generations.
If it materializes, it would give NVIDIA a second packaging source beyond TSMC for AI accelerators — but until both companies confirm, it is unverified analyst speculation.