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Headlines · 6
- Analyst projects SpaceX to receive 20,000 NVIDIA Vera Rubin racks
GF Securities analyst Jeff Pu expects SpaceX to receive 20,000 NVIDIA Vera Rubin NVL72 racks in 2027, making it the largest single buyer in a projected 96,000-rack market. Pu says the six major neoclouds are expected to buy 34,000 racks, or 35% of projected demand, and estimates Foxconn could handle up to 45% of SpaceX's data-center orders.
Wccftech · 🔥 0 - GF Securities raises ASE target price to NT$843 on AI packaging growth
TechNews reported that foreign brokerage GF Securities kept a "buy" rating on ASE Technology Holding and raised its target price from NT$754 to NT$843 per share in a new research note. The note says packaging capacity tightness has spread from AI GPUs to mature-node and analog chips, with lead times extended by more than 30% and OSAT prices up 10%–30% overall, and it projects ASE's LEAP advanced packaging and testing revenue at US$4 billion in 2026 and US$8 billion in 2027, above the company's earlier guidance of US$3.6 billion and US$7.2 billion. GF Securities also expects ASE's FC/Wirebond/QFN packaging prices to rise 10%–80% between Q3 and Q4 2026 and CoWoS prices to have 10%–20% room to rise, citing AMD server CPUs such as Venice and Verano moving to CoWoS.
科技新报 · 🔥 0 - Chinese brokerages pile into third-party AI agent platforms
Economic Observer (republished by Huxiu AI) reports that by October 2026 more than 10 mainstream Chinese securities firms, including GF Securities, Guotai Haitong and China Securities (CSC), had connected to third-party AI platforms such as Kimi, Tencent WorkBuddy, Alibaba's Qwen and Volcano Engine. It describes two routes: publishing research and data tools as Skills inside office workbenches like WorkBuddy, and operating standalone bots inside general assistants like Qwen, citing CSC's Dragonfly Skill launched in late September and Guotai Haitong's Lingxi bot. Analysts and executives quoted say the aim is new user touchpoints and data feedback for in-house models, while industry figures caution the platforms are currently better at targeted reach and prospect screening than at directly winning funded accounts.
虎嗅 AI · 🔥 0 - Dongshan Precision plans 114 million-share global offering, Hong Kong listing on October 28
The supplied report says Dongshan Precision plans a global offering of 114 million shares and a listing on the Hong Kong Stock Exchange on October 28. The report contains only a headline and did not disclose the offering price or total proceeds.
DoNews · 🔥 0 - Dongshan Precision clears HKEX hearing for $2–3B Hong Kong listing
Dongshan Precision passed its Hong Kong Stock Exchange listing hearing on October 11 and has begun pre-marketing a main-board offering expected to raise about US$2 billion to US$3 billion, with UBS, Guotai Haitong, GF Securities and CITIC Securities as joint sponsors, according to a CLS report republished by TMTPost. The report says the company describes itself as the world's largest PCB maker for edge AI devices and an Apple supply-chain member; its roughly 6 billion yuan purchase of Source Photonics in 2025 added optical modules, and Source Photonics accounted for 16.02% of consolidated revenue and 52.92% of profit in the first quarter of 2026. First-half 2026 revenue was 27.798 billion yuan, up 64%, with net profit of about 2.985 billion yuan, up 293.5%, while its A-share market value has fallen from more than 500 billion yuan in June to about 240 billion yuan.
钛媒体 · 🔥 0 - Analyst: Intel Foveros packaging may land another major foundry deal
GF Securities analysts predict Intel's Foveros advanced packaging technology could win another major foundry contract, with NVIDIA cited as the potential customer and the collaboration possibly taking effect in the second half of 2028, according to cnBeta. The report stresses this is only an analyst forecast: neither NVIDIA nor Intel has confirmed adopting Foveros or announced any order, and which Foveros variant or how much capacity is involved remains unverified. It also notes a September 2026 TrendForce report saying TSMC's CoWoS should remain the mainstream advanced packaging for AI chips through 2028, and that NVIDIA invested $5 billion in Intel in September 2025 under an agreement to develop joint products across multiple generations.
cnBeta · 🔥 0
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