ASE raises 2026 LEAP revenue target above $4 billion
ASE Technology Holding reported third-quarter consolidated revenue of NT$244.161 billion and after-tax net income of NT$26.996 billion. It forecast fourth-quarter revenue growth of 6% to 8% sequentially and a gross margin of 23% to 24%. The company raised its 2026 LEAP revenue target from $3.7 billion to more than $4 billion, reiterated expectations of more than $8 billion for 2027, and said CPO entered mass production in the fourth quarter of 2026. According to TechNews, Citi and Morgan Stanley maintained positive ratings and raised their target prices, with the highest cited at NT$908. Management also raised its 2026 capital-spending outlook to $11.5 billion in response to strong customer demand and capacity constraints.
ASE identified advanced packaging as a main growth driver and said its capital-spending increase was intended to address strong customer demand and capacity constraints. The company has 22 new factory plans in Taiwan, with more than half expected to begin contributing revenue by the end of 2027.
半導體封測龍頭日月光投控公布強勁的第 3 季財報與優於預期的第4季展望，受惠於尖端先進封裝（LEAP）需求爆發、產能利用率提升及產品組合優化，日月光投控毛利率擴張趨勢確立，日月光投控指出封測 30% 的毛利率天花板已轉變為未來的「新底線」。對此，花旗（Citi）與摩根士丹利（Morgan Stanley）等外資機構隨後出具最新報告，一致維持正面評級並調升目標價，最高看至 908 元。
日月光投控第3季單季合併營收達新台幣2,441.61億元、單季稅後淨利達269.96億元、季增28%、年增148%，單季每股盈餘（EPS）落在6.13元至6.22元。第3季合併毛利率升至22.1%，其中IC ATM毛利率突破傳統區間達到30.6%。展望第4季，公司財測合併營收將季增6%至8%，合併毛利率進一步提升至23%至24%，營業利益率達14.5%至15.5%。其中封測（ATM）業務營收預計季增11%至13%，毛利率可再增加100至200個基點。
#ASE Technology Holding#LEAP#CPO#CoWoS#IC ATM#Full-process packaging