Foxconn outlines AI rack, CPO and Vera Rubin manufacturing
Foxconn chairman Liu Yang-wei said at Foxconn Technology Day that the company has a cross-country production network covering components, motherboards, system integration and AI racks from Level 1 through Level 12, including power and cooling integration. Foxconn also displayed a Spectrum-X CPO switch manufactured for Nvidia and said its automated processes have turned fiber alignment, assembly and testing into a repeatable mass-production workflow. The company participates in manufacturing for Nvidia’s Vera Rubin platform and said a Cableless solution jointly developed with a customer, together with fully automated assembly, reduced Compute Tray assembly time from more than two hours to 20 minutes. These capability and efficiency claims were not independently verified.
The disclosure details Foxconn’s claimed role across AI-rack, CPO and Vera Rubin manufacturing, highlighting the breadth of its participation in Nvidia-related AI infrastructure supply chains.
鴻海今日舉行科技日活動，董事長劉揚偉在開場致詞中強調，鴻海的競爭優勢不僅在於全球製造規模，更來自精密加工及垂直整合能力。隨著 AI 伺服器需求持續成長，鴻海已建立涵蓋零組件、主機板、系統整合到機櫃製造的跨國生產體系，並透過自動化製程切入共同封裝光學（CPO）領域，擴大在新一代 AI 基礎設施供應鏈的布局。
劉揚偉表示，今年鴻海科技日聚焦加工力與垂直整合力，希望讓外界了解鴻海並非單純從事組裝的代工廠，而是能從產品設計、關鍵零組件、系統組裝到全球物流，提供完整解決方案的系統設計製造服務商。