At its first ecosystem partner conference on Oct. 14, Houmo AI announced two compute-in-memory paths built on SRAM-CIM: a 2D CIM line for compute- and capacity-heavy workloads such as image/video generation and MoE, and a 3D CIM line for bandwidth-hungry dense models; the company says its 3D approach upgrades the underlying logic die to an SRAM-based CIM rather than using conventional 3D stacking alone. Its roadmap lists the already mass-produced 2D CIM chips M30 and M50, the newly in-production first 3D CIM chip A20 — claimed to raise compute utilization by 50% over the previous generation and support up to 16 fully interconnected dies — and the in-development M6X, claimed to reach 3–6x M50's overall capability. Houmo says M50 has won more than 150 product design-ins and serves over 100 customers within a year of mass production; a Lenovo AI host P7 based on M50 is said to run local models up to 122B parameters (190 TOPS, up to 128K context, about 50 tokens/s offline), with details due at an Oct. 24 launch, and its AI ecosystem software has been open-sourced.

Houmo AI·Houmo M50·Houmo A20·+5