Huixi Intelligence, a Beijing-based developer of high-compute chips for embodied AI, said it completed Pre-B+ and B rounds, bringing cumulative 2026 equity financing to more than RMB 2.5 billion, according to 36Kr and DoNews. The Beijing AI Industry Investment Fund led; the Beijing Robotics Industry Development Investment Fund, National AI Industry Investment Fund and other government and market investors participated. Existing backers including Shunwei Capital, Yuansheng Capital and SenseTime Guoxiang Capital increased their positions. Huixi said proceeds will mainly fund a next-generation high-compute chip for embodied AI and accelerate scaled delivery and ecosystem building. It describes its stack as an RPU compute core, the RISE platform built on its in-house Guangzhi R1 chip, and the RhinoVLA pretrained model and development pipeline; it says its mass-production solutions cover embodied AI, L4 unmanned logistics vehicles and passenger-car driver assistance. Earlier rounds: an angel round led by Xiaomi in December 2022, an A round in September 2024 and a Pre-B round of over RMB 800 million in February 2026.