SEMICON West

Headlines · 2

1. 3d
   SEMI: 300mm fab equipment spending to reach $227B by 2029

   SEMI released a new forecast at SEMICON West 2026 projecting global 300mm front-end fab equipment spending of $149 billion this year, up 31% year over year, rising to $227 billion by 2029 with double-digit annual growth in between. The group said 26 new 12-inch fab or line projects start construction in 2026 (one source says 20 excluding pure R&D fabs), versus 18 in 2027, while facilities starting operations or first wafers go from 13 this year to 23 next year. Construction spending grows 23% to $47.5 billion this year and reaches $63.3 billion and $68.4 billion in the following two years; Americas equipment spending is expected to more than double from $18.1 billion in 2026 to $40.6 billion in 2029, covering advanced logic and foundry capacity from Intel, TSMC and Samsung plus Micron's DRAM and Texas Instruments' analog and embedded expansion. SEMI senior director Clark Tseng said AI demand is translating into real fab investment, with advanced packaging and heterogeneous integration growing more important.

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2. 4d
   Yole: CPO, glass substrates and 800V DC power are AI infrastructure's next focus

   Yole CEO Jean-Christophe Eloy, speaking ahead of Semicon West, said wafer demand should keep growing over the next five years at a rate of roughly 35%, noting that GPU market revenue has been growing about five times faster than unit shipments. He named co-packaged optics (CPO), glass substrates, hybrid bonding and 800V DC power delivery in data centers as key technologies for continued AI infrastructure expansion, and forecast the CPO market for switches and compute will grow to $1.8 billion while pluggable optical transceivers stay near $18 billion by 2030. Eloy also expects AI ASIC wafer demand to match or surpass GPUs within five years, with HBM and advanced packaging as major growth areas, and sees long-run wafer demand growing about 6% to 7% a year over 15 to 20 years.

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