Yole: CPO, glass substrates and 800V DC power are AI infrastructure's next focus
Yole CEO Jean-Christophe Eloy, speaking ahead of Semicon West, said wafer demand should keep growing over the next five years at a rate of roughly 35%, noting that GPU market revenue has been growing about five times faster than unit shipments. He named co-packaged optics (CPO), glass substrates, hybrid bonding and 800V DC power delivery in data centers as key technologies for continued AI infrastructure expansion, and forecast the CPO market for switches and compute will grow to $1.8 billion while pluggable optical transceivers stay near $18 billion by 2030. Eloy also expects AI ASIC wafer demand to match or surpass GPUs within five years, with HBM and advanced packaging as major growth areas, and sees long-run wafer demand growing about 6% to 7% a year over 15 to 20 years.
It is a research firm's forecast for how AI computing infrastructure may evolve in packaging, interconnect and power delivery, useful as a directional signal rather than a confirmed product plan.