Rubin Ultra

Headlines · 3

1. 22h
   NVIDIA Weighs PTFE for Next-Generation AI Switch Boards

   NVIDIA exhibited its latest NVLink switch board at the October OCP summit and is considering PTFE for high-speed signal transmission, PCB industry analysts told TechNews. The reported plans include introducing low-dielectric-loss PTFE into the Rubin Ultra switch board or a next-generation orthogonal midplane to reduce signal attenuation. PTFE’s low dielectric loss could support high-speed PCB design, but its poor compatibility with other materials and difficulty forming multilayer boards require a mixed-material approach; the report says PTFE alone cannot be used to make dozens-of-layers AI server boards.

   科技新报 · 🔥 6
2. 6d
   Samsung and SK hynix reportedly ramp 8Hi HBM4 for NVIDIA Rubin Ultra

   Samsung Electronics and SK hynix reportedly plan to mass-produce and ship 8Hi HBM4 to NVIDIA in Q2 2027, with 8-layer supply for Rubin Ultra and standard Rubin increasing as 12-layer production remains active. The reports attribute the shift to the greater cooling and yield challenges associated with taller DRAM stacks. Wccftech assessed the claim as “Questionable,” noting that NVIDIA has not finalized whether Rubin Ultra will use 8Hi HBM4, HBM4E, or a mixed configuration.

   IT之家 AI · 🔥 0
3. Oct 12
   HBM yield ceiling: TrendForce forecasts 2027 supply tightness, blended ASP up 121%

   TrendForce's latest research estimates memory supply will remain tight through 2027 and has revised up its HBM price outlook, projecting blended ASP to rise about 121% year over year, driven by tight overall supply, a higher share of pricier HBM4 shipments and the gradual ramp of HBM4e in the second half of 2027. The article argues that beyond advanced wafer capacity, stacking yield is the key constraint on effective supply: TrendForce data puts current HBM yield at only 50%-60%, with yields typically falling for each new generation, while JPMorgan data shows 58% of 2025-2028 DRAM capacity additions going to HBM, lifting HBM's share of total DRAM capacity from 19% to 31%. Micron has said it will work with TSMC on mass production of next-generation HBM4E in 2027, and per TrendForce, NVIDIA has been reassessing Rubin Ultra's HBM configuration since Q3 2026, weighing HBM4e 12hi/8hi against HBM4 12hi/8hi.

   虎嗅 AI · 🔥 0

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