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- Biwin Storage Advances Wafer-Level Advanced Packaging for AI
Biwin Storage said it is accelerating its strategy combining storage solutions with wafer-level advanced packaging and testing, including faster construction of advanced-packaging manufacturing facilities. The company is advancing R&D and industrialization of FOMS, CMC and OEC technologies for advanced storage, integrated memory-compute packaging and high-speed optoelectronic interconnection. Biwin also said it intends to expand into AI computing-infrastructure markets, which it believes will create medium- and long-term storage opportunities.
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