Nvidia Rubin

Headlines · 4

1. 3h
   Morgan Stanley lifts Q4 DRAM, NAND contract price forecasts; compute still top AI pick

   A Morgan Stanley report raised its memory contract-price forecasts: Q4 2026 DRAM contract prices are now seen up 10–15% quarter over quarter (from +3–8%), with PC DRAM at +13–18% and server DRAM at +10–15%, while NAND moves to +15–20% from +0–5% and enterprise SSDs reach +23–28%. The bank forecasts 2027 HBM average selling prices up 121% year over year, with HBM4 at US$3–5 per Gb and HBM4e above US$5, but says Nvidia's Rubin ramp is behind schedule, with 2026 VR200 NVL72 rack shipments estimated below 10,000 units versus an original target of about 15,000. It keeps its AI supply-chain priority of compute first, networking second and selective memory allocation, and projects DRAM capex of US$98 billion in 2026 (+82%) rising to US$150–160 billion in 2027.

   科技新报 · 🔥 9
2. 2d
   Microsoft Maia 300 vs Nvidia Rubin: specs compared, no clear winner

   Microsoft unveiled Maia 300 on Oct. 12, 2026, and plans to expand its Azure Maia infrastructure to multi-gigawatt deployments starting in 2027, positioning the chip as its primary AI inference engine. Maia 300 pairs 288 GB of HBM4 and 18 TB/s peak bandwidth per accelerator at 950W, with 96 accelerators per rack totaling 27.6 TB of HBM4 and 167 kW; Nvidia's Rubin NVL72 lists 288 GB HBM4 and up to 22 TB/s per GPU, with 72 GPUs and 20.7 TB aggregate HBM4 per rack. Their efficiency claims use different baselines and no independent, workload-matched test exists: Microsoft says Maia 300 delivers 40% more tokens per megawatt than unnamed leading GPU systems, while Nvidia projects Rubin NVL72 at up to 10x the tokens per megawatt of GB200 NVL72, so neither can be declared faster.

   TechRepublic · 🔥 3
3. 5d
   Frore unveils diamond-infused coldplates for 2,300W Nvidia Rubin, claims up to 22C drop

   Frore Systems introduced LiquidJet Diamond, a bespoke liquid-cooling coldplate series that adds diamond-wafer heat spreaders at the bottom of the coldplate to target hotspots on next-generation AI accelerators such as Nvidia's Rubin and AMD's Instinct MI400 and MI500. The company claims the design handles hotspot power densities up to 770 W/cm², lowers GPU temperatures by 16–22C versus conventional coldplates and improves AI token throughput per watt by 30%–35%, though those figures come from its own models and it has not disclosed how the diamond wafers are manufactured or integrated. Frore plans to demonstrate the technology at the OCP Global Summit on October 12–16, showing cooling for Nvidia's 2,300W Rubin, but has not said whether the demo uses production GPUs or a thermal test vehicle.

   Tom’s Hardware · 🔥 0
4. 7d
   Vicor files third Section 337 case, naming 20 AI server supply-chain firms

   The US International Trade Commission opened case 337-TA-1526 on October 9, with power-module maker Vicor accusing 20 companies — including Luxshare Precision, Foxconn, Infineon and Delta Electronics — of infringing patents covering vertical power delivery (VPD). The article says this is Vicor's third Section 337 action in the AI power space, and that its quarterly licensing revenue reached $30.4 million in Q2 versus $10.4 million a year earlier, while a parallel federal suit against MPS (7:26-cv-00364) was filed a day before the ITC complaint. The author expects the case to take roughly 16–18 months and most likely end in a licensing settlement, noting that any exclusion order would only affect US customs, leaving sales outside the US unaffected.

   虎嗅 AI · 🔥 0

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