TSMC reportedly weighs 10%–20% CoWoS price increase amid AI demand
AI summary
Taiwanese media cited supply-chain sources saying TSMC is considering raising CoWoS advanced-packaging prices by 10%–20%, while other foundries and packaging firms are evaluating similar adjustments. TSMC has not confirmed the reported increase. AI accelerator demand has expanded CoWoS orders beyond GPUs to server CPUs and custom ASICs, tightening packaging and testing capacity as relevant equipment lead times reportedly lengthened from three-to-six months to six-to-eight months.
In-depth insight
CoWoS is widely used in advanced AI processors, and supply-chain sources report that demand and testing constraints are putting pressure on packaging capacity, making the proposed pricing relevant to AI-chip manufacturing economics.