Kirin 9030

Headlines · 2

1. 4d
   Huawei Mate 90 series launches with Kirin 9050 Pro logic-folding chip

   Huawei introduced the Mate 90 series with the Kirin 9030, Kirin 9035 and Kirin 9050 Pro chips, alongside displays, imaging and communication upgrades. According to IT之家 and 智东西, the Kirin 9050 Pro combines Lingxi CPU, Maliang GPU and a Da Vinci NPU that Huawei says can deploy a 30B-parameter mixture-of-experts model on-device. Huawei also claimed overall performance gains of 27% for Mate 90, 20% for Mate 90 Pro and 31% for Mate 90 Pro Max, but no independent test results were reported.

   智东西 · 🔥 0
2. Oct 23
   China’s DUV Chipmaking Advances Face Rising Cost and Yield Limits

   Chinese chipmakers are using multiple exposures with DUV lithography to produce advanced logic without ASML’s restricted EUV systems, as seen in teardowns of Huawei’s Kirin 9000S and Kirin 9030. Experts cited by Tom’s Hardware say additional masks increase overlay risks, manufacturing time, die size and cost, while SMIC’s reported N+3 process remains less scaled than established 5nm processes from TSMC and Samsung. Morgan Stanley estimated that CXMT produces about one-third as many bits per wafer as Western competitors, though the report also cites Micron’s success with tightly controlled DUV multiple patterning for DRAM.

   Tom’s Hardware · 🔥 0

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