Intel 18A

Headlines · 4

1. 12h
   Intel shifts Oregon 18A capacity to Intel 3 for Xeon 6 servers

   Intel said it will convert part of its Oregon Intel 18A resources to the Intel 3 process, which is used for Xeon 6 “Granite Rapids” server processors, according to cnBeta and IT之家. The company expects the added Oregon capacity to enter mass production in the second half of 2027, while IT之家 also reported expansion at Fab 24 and Fab 62 and additional advanced-packaging capacity. Intel attributed the reallocation partly to weaker PC demand and stronger server demand linked to AI infrastructure.

   cnBeta · 🔥 16
2. Oct 22
   Intel CTO Says Leading-Edge Wafer Output Can Roughly Double

   Intel CTO Pushkar Ranade told the Dwarkesh Podcast that global leading-edge wafer output could roughly double rather than increase tenfold, even with sufficient funding. IT之家 and The Next Web reported that equipment suppliers, their upstream suppliers, and sub-suppliers must expand together, while EUV tool lead times of about 18 months constrain new capacity. Ranade also said AI compute had grown about threefold annually over the previous decade, though the reports provide no independent methodology for that figure.

   IT之家 AI · 🔥 0
3. Oct 21
   Intel advances Fab 62 and Ohio One construction

   Intel has begun installing production tools at Fab 62 in Arizona and reported construction progress at the Ohio One complex in New Albany. Intel also confirmed integrating High-NA EUV lithography into high-volume manufacturing, while later reporting said it is shifting some capacity from client processors toward data-center CPUs amid AI-related demand. Fab 62’s operating and mass-production schedules differ across reports, and its process-node assignment has not been formally disclosed.

   Tom’s Hardware · 🔥 7
4. Oct 12
   Qualcomm Snapdragon X PC chips said to rise about 10% on advanced-node costs

   Qualcomm's Snapdragon X and Snapdragon X2 PC processors are said to have risen about 10% in price from October 1, 2026, with reports citing rising advanced wafer fabrication and packaging costs. The reports, traced to Taiwan's Economic Daily News and relayed by Wccftech, do not disclose before-and-after prices for individual models, so not every chip's street price necessarily moved by the same amount. Qualcomm relies on its in-house Oryon CPU cores plus integrated GPU and NPU for its PC push and is moving to TSMC's more advanced N2P node, but higher manufacturing costs could erode its price and efficiency pitch against x86 rivals, forcing laptop makers to rebalance retail prices, configurations and margins.

   cnBeta · 🔥 0

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